Formulation of high conducting ink using composites of Ag nanoparticles, Ag nanowires, and polyaniline

Hee Song Jae; Im Lee Bock; Min Lim Chae; Cho Gyoujin

doi:10.1109/NMDC.2006.4388913

Formulation of high conducting ink using composites of Ag nanoparticles, Ag nanowires, and polyaniline

Hee Song Jae
, Im Lee Bock
, Min Lim Chae
, Cho Gyoujin

Sunchon National University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

2 Scopus citations

Abstract

In this presentation, we will demonstrate a new way of formulation method for electronic inks that have a comparable electrical conductivity (2.3 × 10 ⁵ S/cm) to the cupper films.

Original language	English
Title of host publication	2006 IEEE Nanotechnology Materials and Devices Conference, NMDC
Pages	582-583
Number of pages	2
DOIs	https://doi.org/10.1109/NMDC.2006.4388913
State	Published - 2006
Externally published	Yes
Event	2006 IEEE Nanotechnology Materials and Devices Conference, NMDC - Gyeongju, Korea, Republic of Duration: 22 Oct 2006 → 25 Oct 2006

Publication series

Name	2006 IEEE Nanotechnology Materials and Devices Conference, NMDC
Volume	1

Conference

Conference	2006 IEEE Nanotechnology Materials and Devices Conference, NMDC
Country/Territory	Korea, Republic of
City	Gyeongju
Period	22/10/06 → 25/10/06

Keywords

Electronic ink
Polyaniline
Silver nanoparticles
Silver nanowires

Access to Document

10.1109/NMDC.2006.4388913

Cite this

Jae, H. S., Bock, I. L., Chae, M. L., & Gyoujin, C. (2006). Formulation of high conducting ink using composites of Ag nanoparticles, Ag nanowires, and polyaniline. In 2006 IEEE Nanotechnology Materials and Devices Conference, NMDC (pp. 582-583). Article 4388913 (2006 IEEE Nanotechnology Materials and Devices Conference, NMDC; Vol. 1). https://doi.org/10.1109/NMDC.2006.4388913

@inproceedings{2f58284adfe34c4f95e1f8e939b2eee3,

title = "Formulation of high conducting ink using composites of Ag nanoparticles, Ag nanowires, and polyaniline",

abstract = "In this presentation, we will demonstrate a new way of formulation method for electronic inks that have a comparable electrical conductivity (2.3 × 10 5 S/cm) to the cupper films.",

keywords = "Electronic ink, Polyaniline, Silver nanoparticles, Silver nanowires",

author = "Jae, \{Hee Song\} and Bock, \{Im Lee\} and Chae, \{Min Lim\} and Cho Gyoujin",

year = "2006",

doi = "10.1109/NMDC.2006.4388913",

language = "English",

isbn = "1424405408",

series = "2006 IEEE Nanotechnology Materials and Devices Conference, NMDC",

pages = "582--583",

booktitle = "2006 IEEE Nanotechnology Materials and Devices Conference, NMDC",

note = "2006 IEEE Nanotechnology Materials and Devices Conference, NMDC ; Conference date: 22-10-2006 Through 25-10-2006",

}

Jae, HS, Bock, IL, Chae, ML & Gyoujin, C 2006, Formulation of high conducting ink using composites of Ag nanoparticles, Ag nanowires, and polyaniline. in 2006 IEEE Nanotechnology Materials and Devices Conference, NMDC., 4388913, 2006 IEEE Nanotechnology Materials and Devices Conference, NMDC, vol. 1, pp. 582-583, 2006 IEEE Nanotechnology Materials and Devices Conference, NMDC, Gyeongju, Korea, Republic of, 22/10/06. https://doi.org/10.1109/NMDC.2006.4388913

Formulation of high conducting ink using composites of Ag nanoparticles, Ag nanowires, and polyaniline. / Jae, Hee Song; Bock, Im Lee; Chae, Min Lim et al.
2006 IEEE Nanotechnology Materials and Devices Conference, NMDC. 2006. p. 582-583 4388913 (2006 IEEE Nanotechnology Materials and Devices Conference, NMDC; Vol. 1).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Formulation of high conducting ink using composites of Ag nanoparticles, Ag nanowires, and polyaniline

AU - Jae, Hee Song

AU - Bock, Im Lee

AU - Chae, Min Lim

AU - Gyoujin, Cho

PY - 2006

Y1 - 2006

N2 - In this presentation, we will demonstrate a new way of formulation method for electronic inks that have a comparable electrical conductivity (2.3 × 10 5 S/cm) to the cupper films.

AB - In this presentation, we will demonstrate a new way of formulation method for electronic inks that have a comparable electrical conductivity (2.3 × 10 5 S/cm) to the cupper films.

KW - Electronic ink

KW - Polyaniline

KW - Silver nanoparticles

KW - Silver nanowires

UR - https://www.scopus.com/pages/publications/50249188229

U2 - 10.1109/NMDC.2006.4388913

DO - 10.1109/NMDC.2006.4388913

M3 - Conference contribution

AN - SCOPUS:50249188229

SN - 1424405408

SN - 9781424405404

T3 - 2006 IEEE Nanotechnology Materials and Devices Conference, NMDC

SP - 582

EP - 583

BT - 2006 IEEE Nanotechnology Materials and Devices Conference, NMDC

T2 - 2006 IEEE Nanotechnology Materials and Devices Conference, NMDC

Y2 - 22 October 2006 through 25 October 2006

ER -

Formulation of high conducting ink using composites of Ag nanoparticles, Ag nanowires, and polyaniline

Abstract

Publication series

Conference

Keywords

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