Fabrication of paper electrode by dry transfer of Ag NP and Ag NW

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In this study, we found the simple and quick dry transfer method to fabricate a paper-based electrode for flexible printed circuit board (PCB). The conventional Ag nanoparticle (AgNP) suspension with high solid contents above ∼50 wt% was confirmed to be deposited on a super hydrophobic polyethylene terephthalate (SHP-PET) substrate without a special ink formulation or surface treatment of substrate. The AgNP layer on the SHP-PET was able to be transferred only onto the toner-printed region of the paper substrate during a simple lamination process, thereby realizing the patterned AgNP conductive lines on the paper substrates The AgNP/toner/paper electrodes were highly robust, showing no deterioration in conductivity after taping for 100 times. Moreover, the AgNP/toner/paper electrodes successfully functioned as flexible electrodes; thus, light emitting diodes connected to the AgNP/paper electrodes could be operated under folding deformation without significant loss of brightness.

Original languageEnglish
Title of host publication2017 IEEE 19th Electronics Packaging Technology Conference, EPTC 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1-5
Number of pages5
ISBN (Electronic)9781538630426
DOIs
StatePublished - 2 Jul 2017
Event2017 19th IEEE Electronics Packaging Technology Conference, EPTC 2017 - Singapore, Singapore
Duration: 6 Dec 20179 Dec 2017

Publication series

Name2017 IEEE 19th Electronics Packaging Technology Conference, EPTC 2017
Volume2018-February

Conference

Conference2017 19th IEEE Electronics Packaging Technology Conference, EPTC 2017
Country/TerritorySingapore
CitySingapore
Period6/12/179/12/17

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