Fabrication of Ni metal mask by electroforming process using wetting agents

Jun Hyung Lim, Eui Cheol Park, Seung Yi Lee, Jeong Won Yoon, Sang Su Ha, Jinho Joo, Hoo Jeong Lee, Seung Boo Jung, Keun Song

Research output: Contribution to journalArticlepeer-review

7 Scopus citations

Abstract

We fabricated a Ni metal mask using the electroforming process, in combination with photolithography, and evaluated the effects of adding wetting agents to the electrolyte on the microstructure and mechanical properties. Photo masking, exposure, and development procedures were used to produce additive patterns on the stainless steel substrate. Subsequently, a textured Ni metal mask (30 μm thickness and 100 μm hole size) was formed on the substrate using the electroforming process. We found that the microstructure and mechanical properties varied considerably with the different combinations of the wetting agents added, i.e., the addition of SF-1, SF-2, or both SF-1 and SF-2. The addition of both wetting agents significantly reduced the grain size, resulting in an improved Vickers's hardness (638 HV) and a reduced surface roughness (11.39 nm). Moreover, the friction coefficient of the Ni mask was reduced to 0.66. The wear resistance of the Ni mask was comparable to that of a commercial stainless steel mask due to the improved hardness and reduced friction coefficient.

Original languageEnglish
Pages (from-to)1510-1515
Number of pages6
JournalJournal of Electronic Materials
Volume36
Issue number11
DOIs
StatePublished - Nov 2007

Keywords

  • Electroforming
  • Electrolyte
  • Lithography
  • Metal mask
  • Wetting agent

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