Fabrication of a two-step Ni stamp for blind via hole application on PWB

In Soo Park; Jin Soo Kim; Seong Hun Na; Seung Kyu Lim; Young Soo Oh; Su Jeong Suh

doi:10.1016/j.mee.2009.07.016

Fabrication of a two-step Ni stamp for blind via hole application on PWB

In Soo Park, Jin Soo Kim, Seong Hun Na, Seung Kyu Lim, Young Soo Oh, Su Jeong Suh

Department of Advanced Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

7 Scopus citations

Abstract

This study examined imprint lithography with a two-step Ni stamp to solve the laser process problems and simultaneously form a blind via and layer pattern. The Ni stamp was fabricated by electroplating on a dry-etched Si mold, made from a SOI (silicon on insulator) wafer, and pattern replication. For the pattern transfer of the Ni stamp, hot embossing was performed on SU8-coated BT and Si wafer substrates. The residual layer was of a uniform thickness with an embossed shape of acceptable squareness.

Original language	English
Pages (from-to)	1707-1710
Number of pages	4
Journal	Microelectronic Engineering
Volume	87
Issue number	9
DOIs	https://doi.org/10.1016/j.mee.2009.07.016
State	Published - Nov 2010

Keywords

Blind via hole
Hot embossing
Two-step stamp

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10.1016/j.mee.2009.07.016

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title = "Fabrication of a two-step Ni stamp for blind via hole application on PWB",

abstract = "This study examined imprint lithography with a two-step Ni stamp to solve the laser process problems and simultaneously form a blind via and layer pattern. The Ni stamp was fabricated by electroplating on a dry-etched Si mold, made from a SOI (silicon on insulator) wafer, and pattern replication. For the pattern transfer of the Ni stamp, hot embossing was performed on SU8-coated BT and Si wafer substrates. The residual layer was of a uniform thickness with an embossed shape of acceptable squareness.",

keywords = "Blind via hole, Hot embossing, Two-step stamp",

author = "Park, \{In Soo\} and Kim, \{Jin Soo\} and Na, \{Seong Hun\} and Lim, \{Seung Kyu\} and Oh, \{Young Soo\} and Suh, \{Su Jeong\}",

year = "2010",

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doi = "10.1016/j.mee.2009.07.016",

language = "English",

volume = "87",

pages = "1707--1710",

journal = "Microelectronic Engineering",

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T1 - Fabrication of a two-step Ni stamp for blind via hole application on PWB

AU - Park, In Soo

AU - Kim, Jin Soo

AU - Na, Seong Hun

AU - Lim, Seung Kyu

AU - Oh, Young Soo

AU - Suh, Su Jeong

PY - 2010/11

Y1 - 2010/11

N2 - This study examined imprint lithography with a two-step Ni stamp to solve the laser process problems and simultaneously form a blind via and layer pattern. The Ni stamp was fabricated by electroplating on a dry-etched Si mold, made from a SOI (silicon on insulator) wafer, and pattern replication. For the pattern transfer of the Ni stamp, hot embossing was performed on SU8-coated BT and Si wafer substrates. The residual layer was of a uniform thickness with an embossed shape of acceptable squareness.

AB - This study examined imprint lithography with a two-step Ni stamp to solve the laser process problems and simultaneously form a blind via and layer pattern. The Ni stamp was fabricated by electroplating on a dry-etched Si mold, made from a SOI (silicon on insulator) wafer, and pattern replication. For the pattern transfer of the Ni stamp, hot embossing was performed on SU8-coated BT and Si wafer substrates. The residual layer was of a uniform thickness with an embossed shape of acceptable squareness.

KW - Blind via hole

KW - Hot embossing

KW - Two-step stamp

UR - https://www.scopus.com/pages/publications/77955231952

U2 - 10.1016/j.mee.2009.07.016

DO - 10.1016/j.mee.2009.07.016

M3 - Article

AN - SCOPUS:77955231952

SN - 0167-9317

VL - 87

SP - 1707

EP - 1710

JO - Microelectronic Engineering

JF - Microelectronic Engineering

IS - 9

ER -

Fabrication of a two-step Ni stamp for blind via hole application on PWB

Abstract

Keywords

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