Experimental and numerical study of solder bumps impact on the underfill fluid flow under electrohydrodynamic effect
- Rizwan Ul Hassan
- , Shaheer Mohiuddin Khalil
- , Saeed Ahmed Khan
- , Shahzaib Ali
- , Hamza Hussain
- , Dae Hyun Cho
- , Doyoung Byun
Research output: Contribution to journal › Article › peer-review