Etchant-Free Wafer-Scale 2D Transfer and van der Waals 3D Integration via Peel-Off Force Engineering

  • Jinhyeok Pyo
  • , Jungmoon Lim
  • , Junsung Byeon
  • , Sohyeon Park
  • , Sungsan Kang
  • , Seonyou Park
  • , Sung Tae Lee
  • , Eunmin Kim
  • , Min Kyeong Kim
  • , Jung Inn Sohn
  • , John Hong
  • , Jungwan Cho
  • , Kyung Ho Park
  • , Seung Nam Cha
  • , Sangyeon Pak

Research output: Contribution to journal › Article › peer-review

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