Enhancing Cu interconnect reflow in back-end-of-line metal wiring with ultrathin Co liners
- Byeong Hwa Jeong
- , Dong Woo Kim
- , Sun Young Lee
- , Dong Shin Kim
- , Seung Han Lee
- , Sang Ho Lee
- , Masaki Uematsu
- , Yutaka Kokaze
- , Yasuyuki Taura
- , Masamichi Harada
- , Geun Young Yeom
- , Kyong Nam Kim
Research output: Contribution to journal › Article › peer-review
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