@inproceedings{5cb71c47813748eab13ba4f90ee20797,
title = "Embedded bandstop filter in package to enhance the susceptibility of integrated circuits",
abstract = "This paper presents an embedded bandstop filter in package to enhance the electromagnetic susceptibility (EMS) of integrated circuits (ICs). Equivalent model and test based on standards and specifications are the possible way to characterize the EMS of ICs. The designed coplanar bandstop filter is able to be embedded in the interposer of package and can decrease the noise from the external side to the ICs. Hence, the electromagnetic immunity of ICs gets enhanced by the virtue of the miniature filter in package with a common process of printed circuits board (PCB).",
keywords = "Bandstop filter, coplanar meander lines, elctromagnetic susceptibility, Integrated circuits, system in package",
author = "Bo Pu and Kim, \{So Young\} and Wansoo Nah",
note = "Publisher Copyright: {\textcopyright} 2017 IEEE.; 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2017 ; Conference date: 20-06-2017 Through 23-06-2017",
year = "2017",
month = jul,
day = "11",
doi = "10.1109/APEMC.2017.7975423",
language = "English",
series = "2017 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2017",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "56--58",
booktitle = "2017 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2017",
}