Electrical resistivities and TCR behavior of co-sputtered TaN-(Ag, Cu) nanocomposites

In Soo Park; Seong Hun Na; Jin Soo Kim; Seung Kyu Lim; Tae Sung Kim; Su Jeong Suh; Jung Won Lee; Chung Yul-Kyo; Young Soo Oh

doi:10.3938/jkps.54.2323

Electrical resistivities and TCR behavior of co-sputtered TaN-(Ag, Cu) nanocomposites

In Soo Park
, Seong Hun Na
, Jin Soo Kim
, Seung Kyu Lim
, Tae Sung Kim
, Su Jeong Suh
, Jung Won Lee
, Chung Yul-Kyo
, Young Soo Oh

Department of Advanced Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

4 Scopus citations

Abstract

The motivation for this study arose from the potential to control electrical properties, such as the resistivity and the TCR, by fabricating TaN-metal nanocomposite films with electron scattering by nanoparticles in the tantalum-nitride matrix. The present work investigated the correlation between the electrical properties and the microstructures of the nanocomposite films. Co-deposited TaN-Ag and TaN-Cu nanocomposite thin films under a 55 % N ₂partial pressure at a Ta power density of 8.78 W/cm ² and at various Ag and Cu power densities were generated.

Original language	English
Pages (from-to)	2323-2326
Number of pages	4
Journal	Journal of the Korean Physical Society
Volume	54
Issue number	6
DOIs	https://doi.org/10.3938/jkps.54.2323
State	Published - Jun 2009

Keywords

Embedded resistor
Nanocomposites
TaN

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10.3938/jkps.54.2323

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title = "Electrical resistivities and TCR behavior of co-sputtered TaN-(Ag, Cu) nanocomposites",

abstract = "The motivation for this study arose from the potential to control electrical properties, such as the resistivity and the TCR, by fabricating TaN-metal nanocomposite films with electron scattering by nanoparticles in the tantalum-nitride matrix. The present work investigated the correlation between the electrical properties and the microstructures of the nanocomposite films. Co-deposited TaN-Ag and TaN-Cu nanocomposite thin films under a 55 \% N 2partial pressure at a Ta power density of 8.78 W/cm 2 and at various Ag and Cu power densities were generated.",

keywords = "Embedded resistor, Nanocomposites, TaN",

author = "Park, \{In Soo\} and Na, \{Seong Hun\} and Kim, \{Jin Soo\} and Lim, \{Seung Kyu\} and Kim, \{Tae Sung\} and Suh, \{Su Jeong\} and Lee, \{Jung Won\} and Chung Yul-Kyo and Oh, \{Young Soo\}",

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language = "English",

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T1 - Electrical resistivities and TCR behavior of co-sputtered TaN-(Ag, Cu) nanocomposites

AU - Park, In Soo

AU - Na, Seong Hun

AU - Kim, Jin Soo

AU - Lim, Seung Kyu

AU - Kim, Tae Sung

AU - Suh, Su Jeong

AU - Lee, Jung Won

AU - Yul-Kyo, Chung

AU - Oh, Young Soo

PY - 2009/6

Y1 - 2009/6

N2 - The motivation for this study arose from the potential to control electrical properties, such as the resistivity and the TCR, by fabricating TaN-metal nanocomposite films with electron scattering by nanoparticles in the tantalum-nitride matrix. The present work investigated the correlation between the electrical properties and the microstructures of the nanocomposite films. Co-deposited TaN-Ag and TaN-Cu nanocomposite thin films under a 55 % N 2partial pressure at a Ta power density of 8.78 W/cm 2 and at various Ag and Cu power densities were generated.

AB - The motivation for this study arose from the potential to control electrical properties, such as the resistivity and the TCR, by fabricating TaN-metal nanocomposite films with electron scattering by nanoparticles in the tantalum-nitride matrix. The present work investigated the correlation between the electrical properties and the microstructures of the nanocomposite films. Co-deposited TaN-Ag and TaN-Cu nanocomposite thin films under a 55 % N 2partial pressure at a Ta power density of 8.78 W/cm 2 and at various Ag and Cu power densities were generated.

KW - Embedded resistor

KW - Nanocomposites

KW - TaN

UR - https://www.scopus.com/pages/publications/68149182561

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DO - 10.3938/jkps.54.2323

M3 - Article

AN - SCOPUS:68149182561

SN - 0374-4884

VL - 54

SP - 2323

EP - 2326

JO - Journal of the Korean Physical Society

JF - Journal of the Korean Physical Society

IS - 6

ER -

Electrical resistivities and TCR behavior of co-sputtered TaN-(Ag, Cu) nanocomposites

Abstract

Keywords

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