Effects of number of reflows on the mechanical and electrical properties of BGA package

B. I. Noh; J. M. Koo; J. W. Kim; D. G. Kim; J. D. Nam; J. Joo; S. B. Jung

doi:10.1016/j.intermet.2005.11.036

Effects of number of reflows on the mechanical and electrical properties of BGA package

B. I. Noh
, J. M. Koo
, J. W. Kim
, D. G. Kim
, J. D. Nam
, J. Joo
, S. B. Jung

Sungkyunkwan University

Research output: Contribution to journal › Article › peer-review

47 Scopus citations

Abstract

Mechanical and electrical properties of the Sn-37Pb/Cu joints were investigated in terms of the effect of intermetallic compound (IMC) layer growth. A layer of continuous scallop-shaped Cu₆Sn₅ IMC was formed at the interface between the solder and substrate after 1 reflow, while Cu₃Sn IMC layer was formed after 3 reflows. The thickness of the total IMC layer increased as a function of cubic root of reflow time. The shear force of the solder joints did not vary much with the number of reflows. Only ductile failure mode was observed regardless of the number of reflows, and explaining well the shear force variations. The electrical resistivity of the BGA package was measured to investigate the relation between the microstructural variation and electrical properties of the solder joints. The electrical resistivity increased with the number of reflows.

Original language	English
Pages (from-to)	1375-1378
Number of pages	4
Journal	Intermetallics
Volume	14
Issue number	10-11
DOIs	https://doi.org/10.1016/j.intermet.2005.11.036
State	Published - Oct 2006

Keywords

A. Intermetallics, miscellaneous
B. Diffusion
B. Electrical resistance and other electrical properties
C. Joining

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10.1016/j.intermet.2005.11.036

Cite this

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title = "Effects of number of reflows on the mechanical and electrical properties of BGA package",

abstract = "Mechanical and electrical properties of the Sn-37Pb/Cu joints were investigated in terms of the effect of intermetallic compound (IMC) layer growth. A layer of continuous scallop-shaped Cu6Sn5 IMC was formed at the interface between the solder and substrate after 1 reflow, while Cu3Sn IMC layer was formed after 3 reflows. The thickness of the total IMC layer increased as a function of cubic root of reflow time. The shear force of the solder joints did not vary much with the number of reflows. Only ductile failure mode was observed regardless of the number of reflows, and explaining well the shear force variations. The electrical resistivity of the BGA package was measured to investigate the relation between the microstructural variation and electrical properties of the solder joints. The electrical resistivity increased with the number of reflows.",

keywords = "A. Intermetallics, miscellaneous, B. Diffusion, B. Electrical resistance and other electrical properties, C. Joining",

author = "Noh, \{B. I.\} and Koo, \{J. M.\} and Kim, \{J. W.\} and Kim, \{D. G.\} and Nam, \{J. D.\} and J. Joo and Jung, \{S. B.\}",

year = "2006",

month = oct,

doi = "10.1016/j.intermet.2005.11.036",

language = "English",

volume = "14",

pages = "1375--1378",

journal = "Intermetallics",

issn = "0966-9795",

publisher = "Elsevier Ltd",

number = "10-11",

}

TY - JOUR

T1 - Effects of number of reflows on the mechanical and electrical properties of BGA package

AU - Noh, B. I.

AU - Koo, J. M.

AU - Kim, J. W.

AU - Kim, D. G.

AU - Nam, J. D.

AU - Joo, J.

AU - Jung, S. B.

PY - 2006/10

Y1 - 2006/10

N2 - Mechanical and electrical properties of the Sn-37Pb/Cu joints were investigated in terms of the effect of intermetallic compound (IMC) layer growth. A layer of continuous scallop-shaped Cu6Sn5 IMC was formed at the interface between the solder and substrate after 1 reflow, while Cu3Sn IMC layer was formed after 3 reflows. The thickness of the total IMC layer increased as a function of cubic root of reflow time. The shear force of the solder joints did not vary much with the number of reflows. Only ductile failure mode was observed regardless of the number of reflows, and explaining well the shear force variations. The electrical resistivity of the BGA package was measured to investigate the relation between the microstructural variation and electrical properties of the solder joints. The electrical resistivity increased with the number of reflows.

AB - Mechanical and electrical properties of the Sn-37Pb/Cu joints were investigated in terms of the effect of intermetallic compound (IMC) layer growth. A layer of continuous scallop-shaped Cu6Sn5 IMC was formed at the interface between the solder and substrate after 1 reflow, while Cu3Sn IMC layer was formed after 3 reflows. The thickness of the total IMC layer increased as a function of cubic root of reflow time. The shear force of the solder joints did not vary much with the number of reflows. Only ductile failure mode was observed regardless of the number of reflows, and explaining well the shear force variations. The electrical resistivity of the BGA package was measured to investigate the relation between the microstructural variation and electrical properties of the solder joints. The electrical resistivity increased with the number of reflows.

KW - A. Intermetallics, miscellaneous

KW - B. Diffusion

KW - B. Electrical resistance and other electrical properties

KW - C. Joining

UR - https://www.scopus.com/pages/publications/33746605248

U2 - 10.1016/j.intermet.2005.11.036

DO - 10.1016/j.intermet.2005.11.036

M3 - Article

AN - SCOPUS:33746605248

SN - 0966-9795

VL - 14

SP - 1375

EP - 1378

JO - Intermetallics

JF - Intermetallics

IS - 10-11

ER -

Effects of number of reflows on the mechanical and electrical properties of BGA package

Abstract

Keywords

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