Effects of deposition termination on Cu2ZnSnSe4device characteristics

  • I. L. Repins
  • , J. V. Li
  • , A. Kanevce
  • , C. L. Perkins
  • , K. X. Steirer
  • , J. Pankow
  • , G. Teeter
  • , D. Kuciauskas
  • , C. Beall
  • , C. Dehart
  • , J. Carapella
  • , B. Bob
  • , J. S. Park
  • , S. H. Wei

Research output: Contribution to journalArticlepeer-review

Abstract

Co-evaporated Cu2ZnSnSe4(CZTSe) is used to examine sensitivities to the device performance that originate from variations in Zn content very near the surface. While integral Zn content of the film is held approximately constant, the surface composition is manipulated via changes to the Zn flux at the end of the deposition. Surface composition, device performance, and open-circuit voltage extrapolated to zero temperature are measured as a function of deposition termination. Origins of the apparent reduction in surface recombination with increasing Zn are discussed.

Original languageEnglish
Pages (from-to)184-187
Number of pages4
JournalThin Solid Films
Volume582
DOIs
StatePublished - 1 May 2015
Externally publishedYes

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

  1. SDG 7 - Affordable and Clean Energy
    SDG 7 Affordable and Clean Energy

Keywords

  • Copper zinc tin selenide
  • Copper zinc tin sulfide
  • Hole barrier
  • Kesterite
  • Solar cell
  • Surface
  • Thin films
  • Voltage

Fingerprint

Dive into the research topics of 'Effects of deposition termination on Cu2ZnSnSe4device characteristics'. Together they form a unique fingerprint.

Cite this