Effect of parasitic resistance and capacitance on performance of InGaAs HEMT digital logic circuits

Research output: Contribution to journalArticlepeer-review

Abstract

In this brief, the impact of parasitic resistance and capacitance on InGaAs HEMT digital logic circuits is investigated via device simulations and circuit analysis. We present the correlation between device geometry and circuit delay for various structural scenarios. When the gate-to-S/D contact distance Lsg is scaled down to logic device standards, high integration density and additional circuit performance can be expected as compared with experimental devices that are demonstrated to date. This brief highlights the importance of engineering the device structure outside the channel region to achieve high device performance and device density. Scaled InGaAs HEMTs show superior performance over experimental devices and 27% less power consumption for the same circuit-speed constraint.

Original languageEnglish
Pages (from-to)1161-1164
Number of pages4
JournalIEEE Transactions on Electron Devices
Volume56
Issue number5
DOIs
StatePublished - 2009
Externally publishedYes

Keywords

  • Circuit delay
  • Device-pitch scaling
  • Digital logic circuit
  • High-electron mobility transistor (HEMT)
  • III-V
  • InGaAs/InAlAs
  • Parasitic capacitance
  • Series resistance

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