Abstract
We report the effects of oxygen flow rate on the electrical properties of transparent silicon oxynitride (SiON)AgSiON multilayer films, whose layers were formed via continuous sputtering. The SiONAgSiON multilayer that was sputtered at low oxygen flow rates (below 0.6 sccm) showed metallic conduction (ddT > 0) with a resistivity of 2.013 × 10 -4 Ohm-cm, while SiONAgSiON film grown at high oxygen flow rates exhibited insulating behavior. These opposing electrical behaviors are related to the transition of the inserted Ag layer from a continuous layer to a layer of randomly disconnected islands with increasing oxygen flow rate.
| Original language | English |
|---|---|
| Pages (from-to) | H23-H26 |
| Journal | Electrochemical and Solid-State Letters |
| Volume | 15 |
| Issue number | 2 |
| DOIs | |
| State | Published - 2012 |
| Externally published | Yes |