Effect of multiple reflows on interfacial reaction and shear strength of Sn-Ag electroplated solder bumps for flip chip package

Sang Su Ha; Jin Kyu Jang; Sang Ok Ha; Jeong Won Yoon; Hoo Jeong Lee; Jin Ho Joo; Young Ho Kim; Seung Boo Jung

doi:10.1016/j.mee.2009.07.015

Effect of multiple reflows on interfacial reaction and shear strength of Sn-Ag electroplated solder bumps for flip chip package

Sang Su Ha, Jin Kyu Jang, Sang Ok Ha, Jeong Won Yoon, Hoo Jeong Lee, Jin Ho Joo, Young Ho Kim, Seung Boo Jung

Department of Advanced Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

36 Scopus citations

Abstract

The effect of displacement rate and intermetallic compound (IMC) growth on the shear strength of electroplated Sn-2.5Ag (in wt.%) flip chip solder with Cu under-bump metallization (UBM) were investigated after multiple reflows. Cu₆Sn₅ IMC was formed at the interface after one reflow. After five reflows, two different IMC layers, consisting of a scallop-shaped Cu₆Sn₅ phase and a planar Cu₃Sn phase, and their thicknesses increased with increasing reflow number up to 10. The shear strengths peaked after four reflows, and then decreased with increasing reflow number. Increasing displacement rate increased the shear force. The tendency toward brittle fracture characteristics was intensified with increasing displacement rate and reflow number.

Original language	English
Pages (from-to)	517-521
Number of pages	5
Journal	Microelectronic Engineering
Volume	87
Issue number	3
DOIs	https://doi.org/10.1016/j.mee.2009.07.015
State	Published - Mar 2010

Keywords

Flip chip
Interfacial reaction
Intermetallic compound (IMC)
Shear test
Sn-Ag

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10.1016/j.mee.2009.07.015

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@article{64e13d3f81d8474187ae8b42f18dceff,

title = "Effect of multiple reflows on interfacial reaction and shear strength of Sn-Ag electroplated solder bumps for flip chip package",

abstract = "The effect of displacement rate and intermetallic compound (IMC) growth on the shear strength of electroplated Sn-2.5Ag (in wt.\%) flip chip solder with Cu under-bump metallization (UBM) were investigated after multiple reflows. Cu6Sn5 IMC was formed at the interface after one reflow. After five reflows, two different IMC layers, consisting of a scallop-shaped Cu6Sn5 phase and a planar Cu3Sn phase, and their thicknesses increased with increasing reflow number up to 10. The shear strengths peaked after four reflows, and then decreased with increasing reflow number. Increasing displacement rate increased the shear force. The tendency toward brittle fracture characteristics was intensified with increasing displacement rate and reflow number.",

keywords = "Flip chip, Interfacial reaction, Intermetallic compound (IMC), Shear test, Sn-Ag",

author = "Ha, \{Sang Su\} and Jang, \{Jin Kyu\} and Ha, \{Sang Ok\} and Yoon, \{Jeong Won\} and Lee, \{Hoo Jeong\} and Joo, \{Jin Ho\} and Kim, \{Young Ho\} and Jung, \{Seung Boo\}",

year = "2010",

month = mar,

doi = "10.1016/j.mee.2009.07.015",

language = "English",

volume = "87",

pages = "517--521",

journal = "Microelectronic Engineering",

issn = "0167-9317",

publisher = "Elsevier B.V.",

number = "3",

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TY - JOUR

T1 - Effect of multiple reflows on interfacial reaction and shear strength of Sn-Ag electroplated solder bumps for flip chip package

AU - Ha, Sang Su

AU - Jang, Jin Kyu

AU - Ha, Sang Ok

AU - Yoon, Jeong Won

AU - Lee, Hoo Jeong

AU - Joo, Jin Ho

AU - Kim, Young Ho

AU - Jung, Seung Boo

PY - 2010/3

Y1 - 2010/3

N2 - The effect of displacement rate and intermetallic compound (IMC) growth on the shear strength of electroplated Sn-2.5Ag (in wt.%) flip chip solder with Cu under-bump metallization (UBM) were investigated after multiple reflows. Cu6Sn5 IMC was formed at the interface after one reflow. After five reflows, two different IMC layers, consisting of a scallop-shaped Cu6Sn5 phase and a planar Cu3Sn phase, and their thicknesses increased with increasing reflow number up to 10. The shear strengths peaked after four reflows, and then decreased with increasing reflow number. Increasing displacement rate increased the shear force. The tendency toward brittle fracture characteristics was intensified with increasing displacement rate and reflow number.

AB - The effect of displacement rate and intermetallic compound (IMC) growth on the shear strength of electroplated Sn-2.5Ag (in wt.%) flip chip solder with Cu under-bump metallization (UBM) were investigated after multiple reflows. Cu6Sn5 IMC was formed at the interface after one reflow. After five reflows, two different IMC layers, consisting of a scallop-shaped Cu6Sn5 phase and a planar Cu3Sn phase, and their thicknesses increased with increasing reflow number up to 10. The shear strengths peaked after four reflows, and then decreased with increasing reflow number. Increasing displacement rate increased the shear force. The tendency toward brittle fracture characteristics was intensified with increasing displacement rate and reflow number.

KW - Flip chip

KW - Interfacial reaction

KW - Intermetallic compound (IMC)

KW - Shear test

KW - Sn-Ag

UR - https://www.scopus.com/pages/publications/74449085125

U2 - 10.1016/j.mee.2009.07.015

DO - 10.1016/j.mee.2009.07.015

M3 - Article

AN - SCOPUS:74449085125

SN - 0167-9317

VL - 87

SP - 517

EP - 521

JO - Microelectronic Engineering

JF - Microelectronic Engineering

IS - 3

ER -

Effect of multiple reflows on interfacial reaction and shear strength of Sn-Ag electroplated solder bumps for flip chip package

Abstract

Keywords

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