Effect of gold on the corrosion behavior of an electroless nickel/immersion gold surface finish

Q. V. Bui; N. D. Nam; J. W. Yoon; D. H. Choi; A. Kar; J. G. Kim; S. B. Jung

doi:10.1007/s11664-011-1682-1

Effect of gold on the corrosion behavior of an electroless nickel/immersion gold surface finish

Q. V. Bui
, N. D. Nam
, J. W. Yoon
, D. H. Choi
, A. Kar
, J. G. Kim
, S. B. Jung

Department of Advanced Materials Science and Engineering

Sungkyunkwan University
CSIR - National Metallurgical Laboratory

Research output: Contribution to journal › Article › peer-review

14 Scopus citations

Abstract

The performance of surface finishes as a function of the pH of the utilized plating solution was evaluated by electrochemical impedance spectroscopy (EIS) and potentiodynamic polarization tests in 3.5 wt.% NaCl solution. In addition, the surface finishes were examined by x-ray diffraction (XRD), and the contact angle of the liquid/solid interface was recorded. NiP films on copper substrates with gold coatings exhibited their highest coating performance at pH 5. This was attributed to the films having the highest protective efficiency and charge transfer resistance, lowest porosity value, and highest contact angle among those examined as a result of the strongly preferred Au(111) orientation and the improved surface wettability.

Original language	English
Pages (from-to)	1937-1942
Number of pages	6
Journal	Journal of Electronic Materials
Volume	40
Issue number	9
DOIs	https://doi.org/10.1007/s11664-011-1682-1
State	Published - Sep 2011

Keywords

corrosion resistance
Electronic materials
gold
NiP

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10.1007/s11664-011-1682-1

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title = "Effect of gold on the corrosion behavior of an electroless nickel/immersion gold surface finish",

abstract = "The performance of surface finishes as a function of the pH of the utilized plating solution was evaluated by electrochemical impedance spectroscopy (EIS) and potentiodynamic polarization tests in 3.5 wt.\% NaCl solution. In addition, the surface finishes were examined by x-ray diffraction (XRD), and the contact angle of the liquid/solid interface was recorded. NiP films on copper substrates with gold coatings exhibited their highest coating performance at pH 5. This was attributed to the films having the highest protective efficiency and charge transfer resistance, lowest porosity value, and highest contact angle among those examined as a result of the strongly preferred Au(111) orientation and the improved surface wettability.",

keywords = "corrosion resistance, Electronic materials, gold, NiP",

author = "Bui, \{Q. V.\} and Nam, \{N. D.\} and Yoon, \{J. W.\} and Choi, \{D. H.\} and A. Kar and Kim, \{J. G.\} and Jung, \{S. B.\}",

year = "2011",

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doi = "10.1007/s11664-011-1682-1",

language = "English",

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T1 - Effect of gold on the corrosion behavior of an electroless nickel/immersion gold surface finish

AU - Bui, Q. V.

AU - Nam, N. D.

AU - Yoon, J. W.

AU - Choi, D. H.

AU - Kar, A.

AU - Kim, J. G.

AU - Jung, S. B.

PY - 2011/9

Y1 - 2011/9

N2 - The performance of surface finishes as a function of the pH of the utilized plating solution was evaluated by electrochemical impedance spectroscopy (EIS) and potentiodynamic polarization tests in 3.5 wt.% NaCl solution. In addition, the surface finishes were examined by x-ray diffraction (XRD), and the contact angle of the liquid/solid interface was recorded. NiP films on copper substrates with gold coatings exhibited their highest coating performance at pH 5. This was attributed to the films having the highest protective efficiency and charge transfer resistance, lowest porosity value, and highest contact angle among those examined as a result of the strongly preferred Au(111) orientation and the improved surface wettability.

AB - The performance of surface finishes as a function of the pH of the utilized plating solution was evaluated by electrochemical impedance spectroscopy (EIS) and potentiodynamic polarization tests in 3.5 wt.% NaCl solution. In addition, the surface finishes were examined by x-ray diffraction (XRD), and the contact angle of the liquid/solid interface was recorded. NiP films on copper substrates with gold coatings exhibited their highest coating performance at pH 5. This was attributed to the films having the highest protective efficiency and charge transfer resistance, lowest porosity value, and highest contact angle among those examined as a result of the strongly preferred Au(111) orientation and the improved surface wettability.

KW - corrosion resistance

KW - Electronic materials

KW - gold

KW - NiP

UR - https://www.scopus.com/pages/publications/80051591846

U2 - 10.1007/s11664-011-1682-1

DO - 10.1007/s11664-011-1682-1

M3 - Article

AN - SCOPUS:80051591846

SN - 0361-5235

VL - 40

SP - 1937

EP - 1942

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

IS - 9

ER -

Effect of gold on the corrosion behavior of an electroless nickel/immersion gold surface finish

Abstract

Keywords

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