Effect of filler size and its bimodal distribution for highly thermal-conductive epoxy composites

J. Hong, S. Yoon, T. Hwang, J. Oh, Y. Lee, J. Nam

Research output: Contribution to conference › Paper › peer-review

Original language	English
State	Published - 2011
Event	18th International Conference on Composites Materials, ICCM 2011 - Jeju, Korea, Republic of Duration: 21 Aug 2011 → 26 Aug 2011

Conference	18th International Conference on Composites Materials, ICCM 2011
Country/Territory	Korea, Republic of
City	Jeju
Period	21/08/11 → 26/08/11

Cite this

@conference{004a643807f04f1e9c31ce2c2e3ea1aa,

title = "Effect of filler size and its bimodal distribution for highly thermal-conductive epoxy composites",

author = "J. Hong and S. Yoon and T. Hwang and J. Oh and Y. Lee and J. Nam",

year = "2011",

language = "English",

note = "18th International Conference on Composites Materials, ICCM 2011 ; Conference date: 21-08-2011 Through 26-08-2011",

}

TY - CONF

T1 - Effect of filler size and its bimodal distribution for highly thermal-conductive epoxy composites

AU - Hong, J.

AU - Yoon, S.

AU - Hwang, T.

AU - Oh, J.

AU - Lee, Y.

AU - Nam, J.

PY - 2011

Y1 - 2011

UR - https://www.scopus.com/pages/publications/84875929540

M3 - Paper

AN - SCOPUS:84875929540

T2 - 18th International Conference on Composites Materials, ICCM 2011

Y2 - 21 August 2011 through 26 August 2011

ER -