Effect of dielectric barrier discharge on surface modification characteristics of polyimide film

W. J. Park; S. G. Yoon; W. S. Jung; D. H. Yoon

doi:10.1016/j.surfcoat.2006.07.203

Effect of dielectric barrier discharge on surface modification characteristics of polyimide film

W. J. Park, S. G. Yoon, W. S. Jung, D. H. Yoon

Department of Advanced Materials Science and Engineering

Sungkyunkwan University

Research output: Contribution to journal › Article › peer-review

21 Scopus citations

Abstract

Polyimide (PI) films have been used extensively in electronic packaging because of their excellent thermal stability, good mechanical properties, low dielectric constant and good chemical resistance. The effect of dielectric barrier discharge (DBD) plasma treatment on the surface properties and adhesion characteristics of PI films were investigated by means of X-ray photoelectron spectroscopy (XPS), surface free energy analysis and atomic microscopy (AFM). The increasing number of C = O and C-O-C species observed on the surface of the PI films after the DBD plasma treatment is attributable to the oxidation in air of the active species on the PI surface induced by the DBD treatment, and the increase in the surface energy of the PI films treated by DBD plasma is attributed to the improvement in both the polar and London dispersive components. Also, the root mean square roughness (R_a) of the PI film surface was confirmed by AFM observation.

Original language	English
Pages (from-to)	5017-5020
Number of pages	4
Journal	Surface and Coatings Technology
Volume	201
Issue number	9-11 SPEC. ISS.
DOIs	https://doi.org/10.1016/j.surfcoat.2006.07.203
State	Published - 26 Feb 2007

Keywords

Adhesion properties
DBD plasma
Polyimide film
Surface modification

Access to Document

10.1016/j.surfcoat.2006.07.203

Cite this

@article{c1360f24fab34f40a3a61d264f940819,

title = "Effect of dielectric barrier discharge on surface modification characteristics of polyimide film",

abstract = "Polyimide (PI) films have been used extensively in electronic packaging because of their excellent thermal stability, good mechanical properties, low dielectric constant and good chemical resistance. The effect of dielectric barrier discharge (DBD) plasma treatment on the surface properties and adhesion characteristics of PI films were investigated by means of X-ray photoelectron spectroscopy (XPS), surface free energy analysis and atomic microscopy (AFM). The increasing number of C = O and C-O-C species observed on the surface of the PI films after the DBD plasma treatment is attributable to the oxidation in air of the active species on the PI surface induced by the DBD treatment, and the increase in the surface energy of the PI films treated by DBD plasma is attributed to the improvement in both the polar and London dispersive components. Also, the root mean square roughness (Ra) of the PI film surface was confirmed by AFM observation.",

keywords = "Adhesion properties, DBD plasma, Polyimide film, Surface modification",

author = "Park, \{W. J.\} and Yoon, \{S. G.\} and Jung, \{W. S.\} and Yoon, \{D. H.\}",

year = "2007",

month = feb,

day = "26",

doi = "10.1016/j.surfcoat.2006.07.203",

language = "English",

volume = "201",

pages = "5017--5020",

journal = "Surface and Coatings Technology",

issn = "0257-8972",

publisher = "Elsevier B.V.",

number = "9-11 SPEC. ISS.",

}

TY - JOUR

T1 - Effect of dielectric barrier discharge on surface modification characteristics of polyimide film

AU - Park, W. J.

AU - Yoon, S. G.

AU - Jung, W. S.

AU - Yoon, D. H.

PY - 2007/2/26

Y1 - 2007/2/26

N2 - Polyimide (PI) films have been used extensively in electronic packaging because of their excellent thermal stability, good mechanical properties, low dielectric constant and good chemical resistance. The effect of dielectric barrier discharge (DBD) plasma treatment on the surface properties and adhesion characteristics of PI films were investigated by means of X-ray photoelectron spectroscopy (XPS), surface free energy analysis and atomic microscopy (AFM). The increasing number of C = O and C-O-C species observed on the surface of the PI films after the DBD plasma treatment is attributable to the oxidation in air of the active species on the PI surface induced by the DBD treatment, and the increase in the surface energy of the PI films treated by DBD plasma is attributed to the improvement in both the polar and London dispersive components. Also, the root mean square roughness (Ra) of the PI film surface was confirmed by AFM observation.

AB - Polyimide (PI) films have been used extensively in electronic packaging because of their excellent thermal stability, good mechanical properties, low dielectric constant and good chemical resistance. The effect of dielectric barrier discharge (DBD) plasma treatment on the surface properties and adhesion characteristics of PI films were investigated by means of X-ray photoelectron spectroscopy (XPS), surface free energy analysis and atomic microscopy (AFM). The increasing number of C = O and C-O-C species observed on the surface of the PI films after the DBD plasma treatment is attributable to the oxidation in air of the active species on the PI surface induced by the DBD treatment, and the increase in the surface energy of the PI films treated by DBD plasma is attributed to the improvement in both the polar and London dispersive components. Also, the root mean square roughness (Ra) of the PI film surface was confirmed by AFM observation.

KW - Adhesion properties

KW - DBD plasma

KW - Polyimide film

KW - Surface modification

UR - https://www.scopus.com/pages/publications/33846528436

U2 - 10.1016/j.surfcoat.2006.07.203

DO - 10.1016/j.surfcoat.2006.07.203

M3 - Article

AN - SCOPUS:33846528436

SN - 0257-8972

VL - 201

SP - 5017

EP - 5020

JO - Surface and Coatings Technology

JF - Surface and Coatings Technology

IS - 9-11 SPEC. ISS.

ER -

Effect of dielectric barrier discharge on surface modification characteristics of polyimide film

Abstract

Keywords

Access to Document

Other files and links

Fingerprint

Cite this