Effect of Ar/N2 Two-Step Plasma Treatments on the Interfacial Characteristics of Low-Temperature Cu-Cu Direct Bonding

  • Gahui Kim
  • , Seonghun Choi
  • , Yongbeom Kwon
  • , Sarah Eunkyung Kim
  • , Hoo Jeong Lee
  • , Young Bae Park

Research output: Contribution to journalArticlepeer-review

1 Scopus citations

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