Effect of a Pd sacrifice layer on the interfacial reaction in Sn-3.5Ag/Pd/Cu

Seong Hun Na; Jin Soo Kim; Seung Kyu Lim; Su Jeong Suh

doi:10.3938/jkps.61.1263

Effect of a Pd sacrifice layer on the interfacial reaction in Sn-3.5Ag/Pd/Cu

Seong Hun Na
, Jin Soo Kim
, Seung Kyu Lim
, Su Jeong Suh

Department of Advanced Materials Science and Engineering

Sungkyunkwan University

Research output: Contribution to journal › Article › peer-review

1 Scopus citations

Abstract

The effect of a Pd layer on the interfacial reaction in Sn-3. 5Ag/Pd/Cu was studied by varying the thickness of the Pd layer. The formation of PdSn ₄, (Pd _1-xCu _x)Sn ₄, and (Cu _1-yPd _y) ₆Sn ₅ intermetallic compounds (IMCs), along with CuSn IMCs, was observed. The Sn-3. 5Ag/Pd/Cu structure did not suppress the growth of the (Cu _1-yPd _y) ₆Sn ₅ IMCs, but the growth of Cu ₃Sn IMCs was inhibited by the presence of a 200- to 600-nm-thick Pd layer.

Original language	English
Pages (from-to)	1263-1266
Number of pages	4
Journal	Journal of the Korean Physical Society
Volume	61
Issue number	8
DOIs	https://doi.org/10.3938/jkps.61.1263
State	Published - Oct 2012

Keywords

Intermetallic compounds
Lead-free solder
Pd sacrifice layer
Thermal aging

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title = "Effect of a Pd sacrifice layer on the interfacial reaction in Sn-3.5Ag/Pd/Cu",

abstract = "The effect of a Pd layer on the interfacial reaction in Sn-3. 5Ag/Pd/Cu was studied by varying the thickness of the Pd layer. The formation of PdSn 4, (Pd 1-xCu x)Sn 4, and (Cu 1-yPd y) 6Sn 5 intermetallic compounds (IMCs), along with CuSn IMCs, was observed. The Sn-3. 5Ag/Pd/Cu structure did not suppress the growth of the (Cu 1-yPd y) 6Sn 5 IMCs, but the growth of Cu 3Sn IMCs was inhibited by the presence of a 200- to 600-nm-thick Pd layer.",

keywords = "Intermetallic compounds, Lead-free solder, Pd sacrifice layer, Thermal aging",

author = "Na, \{Seong Hun\} and Kim, \{Jin Soo\} and Lim, \{Seung Kyu\} and Suh, \{Su Jeong\}",

year = "2012",

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doi = "10.3938/jkps.61.1263",

language = "English",

volume = "61",

pages = "1263--1266",

journal = "Journal of the Korean Physical Society",

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T1 - Effect of a Pd sacrifice layer on the interfacial reaction in Sn-3.5Ag/Pd/Cu

AU - Na, Seong Hun

AU - Kim, Jin Soo

AU - Lim, Seung Kyu

AU - Suh, Su Jeong

PY - 2012/10

Y1 - 2012/10

N2 - The effect of a Pd layer on the interfacial reaction in Sn-3. 5Ag/Pd/Cu was studied by varying the thickness of the Pd layer. The formation of PdSn 4, (Pd 1-xCu x)Sn 4, and (Cu 1-yPd y) 6Sn 5 intermetallic compounds (IMCs), along with CuSn IMCs, was observed. The Sn-3. 5Ag/Pd/Cu structure did not suppress the growth of the (Cu 1-yPd y) 6Sn 5 IMCs, but the growth of Cu 3Sn IMCs was inhibited by the presence of a 200- to 600-nm-thick Pd layer.

AB - The effect of a Pd layer on the interfacial reaction in Sn-3. 5Ag/Pd/Cu was studied by varying the thickness of the Pd layer. The formation of PdSn 4, (Pd 1-xCu x)Sn 4, and (Cu 1-yPd y) 6Sn 5 intermetallic compounds (IMCs), along with CuSn IMCs, was observed. The Sn-3. 5Ag/Pd/Cu structure did not suppress the growth of the (Cu 1-yPd y) 6Sn 5 IMCs, but the growth of Cu 3Sn IMCs was inhibited by the presence of a 200- to 600-nm-thick Pd layer.

KW - Intermetallic compounds

KW - Lead-free solder

KW - Pd sacrifice layer

KW - Thermal aging

UR - https://www.scopus.com/pages/publications/84868311319

U2 - 10.3938/jkps.61.1263

DO - 10.3938/jkps.61.1263

M3 - Article

AN - SCOPUS:84868311319

SN - 0374-4884

VL - 61

SP - 1263

EP - 1266

JO - Journal of the Korean Physical Society

JF - Journal of the Korean Physical Society

IS - 8

ER -

Effect of a Pd sacrifice layer on the interfacial reaction in Sn-3.5Ag/Pd/Cu

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