Dry etching of GaN using reactive ion beam etching and chemically assisted reactive ion beam etching

J. W. Lee, H. S. Park, Y. J. Park, M. C. Yoo, T. I. Kim, H. S. Kim, G. Y. Yeom

Research output: Contribution to journalConference articlepeer-review

5 Scopus citations

Abstract

Dry etching characteristics of GaN using reactive ion beam etching (RIBE) were studied. Etching profile, etching rate and etching selectivity to a photoresist (PR) mask were investigated as a function of various etching parameters. Characteristics of chemically assisted reactive ion beam etching (CARIBE) and RIBE were compared at varied mixtures of CH4 and Cl2. A highly anisotropic etching profile with a smooth surface was obtained for tilled RIBE with Cl2 at room temperature. Etching selectivity to a PR was dramatically improved in RIBE and CARIBE when a volume fraction of CH4 to the mixture of CH4 and Cl2 was larger than 0.83.

Original languageEnglish
Pages (from-to)373-377
Number of pages5
JournalMaterials Research Society Symposium - Proceedings
Volume468
DOIs
StatePublished - 1997
Externally publishedYes
EventProceedings of the 1997 MRS Spring Symposium - San Francisco, CA, USA
Duration: 1 Apr 19974 Apr 1997

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