Direct metallization of gold patterns on polyimide substrate by microcontact printing and selective surface modification

S. S. Yoon, D. O. Kim, S. C. Park, Y. K. Lee, H. Y. Chae, S. B. Jung, J. D. Nam

Research output: Contribution to journalArticlepeer-review

42 Scopus citations

Abstract

Patterned gold microstructures were fabricated on a polymer substrate by a novel method involving selective electroless plating and microcontact printing. The micro-sized gold patterns were made by the site-selective chemical modification of polyimide substrate films using aqueous potassium hydroxide solution and microcontact printing with a pitch size in the range of 20-200 μm. The base-treated area of the polyimide film became hydrophilic in the regions where the ion-exchange reactions took place for the subsequent metallization. The hydrophilic patterns were sensitized by placing the film in a solution of PdCl2 and, subsequently, the activated substrate was immersed in an electroless plating solution of Ni and Au to provide well-developed gold patterns on polyimide substrate films.

Original languageEnglish
Pages (from-to)136-142
Number of pages7
JournalMicroelectronic Engineering
Volume85
Issue number1
DOIs
StatePublished - Jan 2008

Keywords

  • Electroless plating
  • Gold
  • Microcontact printing
  • Polyimide film

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