Development of multi-axial micro force measurement method for electronic device assembly

June Choi Byung; Heon Ryu Sang; Hwa Ha Seung; Cong Phung Tri; Choon Koo Ja; Park Sangdeok; Lee Sangmoo; Ryeol Choi Hyouk

doi:10.1109/SICE.2006.315578

Development of multi-axial micro force measurement method for electronic device assembly

June Choi Byung
, Heon Ryu Sang
, Hwa Ha Seung
, Cong Phung Tri
, Choon Koo Ja
, Park Sangdeok
, Lee Sangmoo
, Ryeol Choi Hyouk

Department of Mechanical Engineering

Sungkyunkwan University
Korea Institute of Industrial Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Scopus citations

Abstract

A multi-axial micro force measurement system that can detect contact information of micro-scaled object interactions is presented. An accurate measurement of forces in the range of milli or micro newtons becomes an essential tool for the development of high-precision robot systems. The presented force measurement system consists of semiconductor strain gauges and 6-axis force/torque sensor. Implementation of the dual semiconductor strain gauges with a 6-axis force/torque sensor that are installed on a small manipulator system enables the identification of the applied force and contact position. Theoretical consideration of the method followed by an experimental verification is provided.

Original language	English
Title of host publication	2006 SICE-ICASE International Joint Conference
Pages	1380-1384
Number of pages	5
DOIs	https://doi.org/10.1109/SICE.2006.315578
State	Published - 2006
Event	2006 SICE-ICASE International Joint Conference - Busan, Korea, Republic of Duration: 18 Oct 2006 → 21 Oct 2006

Publication series

Name	2006 SICE-ICASE International Joint Conference

Conference

Conference	2006 SICE-ICASE International Joint Conference
Country/Territory	Korea, Republic of
City	Busan
Period	18/10/06 → 21/10/06

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 9 Industry, Innovation, and Infrastructure

Keywords

6-axis F/T sensor
High precision control
Micro assembly
Micro manipulation
Semiconductor strain gauge

Access to Document

10.1109/SICE.2006.315578

Cite this

Byung, J. C., Sang, H. R., Seung, H. H., Tri, C. P., Ja, C. K., Sangdeok, P., Sangmoo, L., & Hyouk, R. C. (2006). Development of multi-axial micro force measurement method for electronic device assembly. In 2006 SICE-ICASE International Joint Conference (pp. 1380-1384). Article 4109181 (2006 SICE-ICASE International Joint Conference). https://doi.org/10.1109/SICE.2006.315578

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title = "Development of multi-axial micro force measurement method for electronic device assembly",

abstract = "A multi-axial micro force measurement system that can detect contact information of micro-scaled object interactions is presented. An accurate measurement of forces in the range of milli or micro newtons becomes an essential tool for the development of high-precision robot systems. The presented force measurement system consists of semiconductor strain gauges and 6-axis force/torque sensor. Implementation of the dual semiconductor strain gauges with a 6-axis force/torque sensor that are installed on a small manipulator system enables the identification of the applied force and contact position. Theoretical consideration of the method followed by an experimental verification is provided.",

keywords = "6-axis F/T sensor, High precision control, Micro assembly, Micro manipulation, Semiconductor strain gauge",

author = "Byung, \{June Choi\} and Sang, \{Heon Ryu\} and Seung, \{Hwa Ha\} and Tri, \{Cong Phung\} and Ja, \{Choon Koo\} and Park Sangdeok and Lee Sangmoo and Hyouk, \{Ryeol Choi\}",

year = "2006",

doi = "10.1109/SICE.2006.315578",

language = "English",

isbn = "8995003855",

series = "2006 SICE-ICASE International Joint Conference",

pages = "1380--1384",

booktitle = "2006 SICE-ICASE International Joint Conference",

note = "2006 SICE-ICASE International Joint Conference ; Conference date: 18-10-2006 Through 21-10-2006",

}

Byung, JC, Sang, HR, Seung, HH, Tri, CP, Ja, CK, Sangdeok, P, Sangmoo, L & Hyouk, RC 2006, Development of multi-axial micro force measurement method for electronic device assembly. in 2006 SICE-ICASE International Joint Conference., 4109181, 2006 SICE-ICASE International Joint Conference, pp. 1380-1384, 2006 SICE-ICASE International Joint Conference, Busan, Korea, Republic of, 18/10/06. https://doi.org/10.1109/SICE.2006.315578

Development of multi-axial micro force measurement method for electronic device assembly. / Byung, June Choi; Sang, Heon Ryu; Seung, Hwa Ha et al.
2006 SICE-ICASE International Joint Conference. 2006. p. 1380-1384 4109181 (2006 SICE-ICASE International Joint Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Development of multi-axial micro force measurement method for electronic device assembly

AU - Byung, June Choi

AU - Sang, Heon Ryu

AU - Seung, Hwa Ha

AU - Tri, Cong Phung

AU - Ja, Choon Koo

AU - Sangdeok, Park

AU - Sangmoo, Lee

AU - Hyouk, Ryeol Choi

PY - 2006

Y1 - 2006

N2 - A multi-axial micro force measurement system that can detect contact information of micro-scaled object interactions is presented. An accurate measurement of forces in the range of milli or micro newtons becomes an essential tool for the development of high-precision robot systems. The presented force measurement system consists of semiconductor strain gauges and 6-axis force/torque sensor. Implementation of the dual semiconductor strain gauges with a 6-axis force/torque sensor that are installed on a small manipulator system enables the identification of the applied force and contact position. Theoretical consideration of the method followed by an experimental verification is provided.

AB - A multi-axial micro force measurement system that can detect contact information of micro-scaled object interactions is presented. An accurate measurement of forces in the range of milli or micro newtons becomes an essential tool for the development of high-precision robot systems. The presented force measurement system consists of semiconductor strain gauges and 6-axis force/torque sensor. Implementation of the dual semiconductor strain gauges with a 6-axis force/torque sensor that are installed on a small manipulator system enables the identification of the applied force and contact position. Theoretical consideration of the method followed by an experimental verification is provided.

KW - 6-axis F/T sensor

KW - High precision control

KW - Micro assembly

KW - Micro manipulation

KW - Semiconductor strain gauge

UR - https://www.scopus.com/pages/publications/34250758049

U2 - 10.1109/SICE.2006.315578

DO - 10.1109/SICE.2006.315578

M3 - Conference contribution

AN - SCOPUS:34250758049

SN - 8995003855

SN - 9788995003855

T3 - 2006 SICE-ICASE International Joint Conference

SP - 1380

EP - 1384

BT - 2006 SICE-ICASE International Joint Conference

T2 - 2006 SICE-ICASE International Joint Conference

Y2 - 18 October 2006 through 21 October 2006

ER -

Development of multi-axial micro force measurement method for electronic device assembly

Abstract

Publication series

Conference

UN SDGs

Keywords

Access to Document

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