TY - GEN
T1 - Design, fabrication, and characterization of a microturbopump for a rankine cycle micro power generator
AU - Lee, Changgu
AU - Liamini, Mokhtar
AU - Fréchette, Luc G.
N1 - Publisher Copyright:
© 2006 TRF.
PY - 2006
Y1 - 2006
N2 - A microfabricated turbopump has been designed, fabricated and experimentally characterized as the core component of a micro steam turbine power-plant-on-a-chip, which aims to implement the Rankine thermal cycle for micro power generation. The device consists of a four-stage radial planar type turbine and a spiral groove viscous pump supported on gas-lubricated bearings. The device is composed of five wafers: one glass wafer, one SOI wafer, and three silicon wafers. The silicon and SOI wafers are patterned using shallow and deep reactive ion etching (total of 14 masks), while the Pyrex glass wafer are ultrasonically drilled. Anodic bonding, fusion bonding and manual assembly with alignment structures were then used to complete the device and enclose the 4 mm diameter rotor. In a test using compressed air to drive the turbine, the rotor was spun up to 116,000 rpm, which corresponds to 25m/s in tip speed producing 0.073 W of mechanical power, and the pump pressurized water by 88kPa with a flow rate of 4mg/s. The pump performance chart was also completely characterized for speeds up to 120,000 rpm. A 1-D pump model based on lubrication theory has shown close agreement with the data and predicted 7.2% of maximum pump efficiency over the range of operating speeds.
AB - A microfabricated turbopump has been designed, fabricated and experimentally characterized as the core component of a micro steam turbine power-plant-on-a-chip, which aims to implement the Rankine thermal cycle for micro power generation. The device consists of a four-stage radial planar type turbine and a spiral groove viscous pump supported on gas-lubricated bearings. The device is composed of five wafers: one glass wafer, one SOI wafer, and three silicon wafers. The silicon and SOI wafers are patterned using shallow and deep reactive ion etching (total of 14 masks), while the Pyrex glass wafer are ultrasonically drilled. Anodic bonding, fusion bonding and manual assembly with alignment structures were then used to complete the device and enclose the 4 mm diameter rotor. In a test using compressed air to drive the turbine, the rotor was spun up to 116,000 rpm, which corresponds to 25m/s in tip speed producing 0.073 W of mechanical power, and the pump pressurized water by 88kPa with a flow rate of 4mg/s. The pump performance chart was also completely characterized for speeds up to 120,000 rpm. A 1-D pump model based on lubrication theory has shown close agreement with the data and predicted 7.2% of maximum pump efficiency over the range of operating speeds.
UR - https://www.scopus.com/pages/publications/84885251062
M3 - Conference contribution
AN - SCOPUS:84885251062
T3 - Technical Digest - Solid-State Sensors, Actuators, and Microsystems Workshop
SP - 276
EP - 279
BT - 2006 Solid-State Sensors, Actuators, and Microsystems Workshop, Hilton Head 2006
A2 - Kenny, Thomas W.
A2 - Spangler, Leland
PB - Transducer Research Foundation
T2 - 13th Solid-State Sensors, Actuators, and Microsystems Workshop, Hilton Head 2006
Y2 - 4 June 2006 through 8 June 2006
ER -