Abstract
In this work, the degradation of poly(ethylene glycol-propylene glycol) copolymer (PEG-PPG) and its effect on the electrodeposition of Cu were investigated. PEG-PPG became fragmented during the electrodeposition with changing its terminal groups from hydroxyl to aldehyde, formic ester, and ketone. The aged solution showed a higher saturation current density than the fresh solution in chronoamperometry (CA) measurements, resulting from an easier desorption of the cleaved PEG-PPG from the copper surface through the competition with bis-(3-sulfopropyl)-disulfide (SPS). Furthermore, the electrical resistivity of Cu films deposited from the aged solution increased due to a decrease in the grain sizes.
| Original language | English |
|---|---|
| Pages (from-to) | 85-91 |
| Number of pages | 7 |
| Journal | Journal of Electroanalytical Chemistry |
| Volume | 714-715 |
| DOIs | |
| State | Published - 1 Feb 2014 |
| Externally published | Yes |
Keywords
- Additive
- Copper electrodeposition
- Cyclic voltammetry stripping
- Decomposition
- Poly(ethylene glycol-propylene glycol)