Degradation of poly(ethylene glycol-propylene glycol) copolymer and its influences on copper electrodeposition

  • Seunghoe Choe
  • , Myung Jun Kim
  • , Hoe Chul Kim
  • , Taeho Lim
  • , Kyung Ju Park
  • , Kwang Hwan Kim
  • , Sang Hyun Ahn
  • , Anna Lee
  • , Soo Kil Kim
  • , Jae Jeong Kim

Research output: Contribution to journalArticlepeer-review

21 Scopus citations

Abstract

In this work, the degradation of poly(ethylene glycol-propylene glycol) copolymer (PEG-PPG) and its effect on the electrodeposition of Cu were investigated. PEG-PPG became fragmented during the electrodeposition with changing its terminal groups from hydroxyl to aldehyde, formic ester, and ketone. The aged solution showed a higher saturation current density than the fresh solution in chronoamperometry (CA) measurements, resulting from an easier desorption of the cleaved PEG-PPG from the copper surface through the competition with bis-(3-sulfopropyl)-disulfide (SPS). Furthermore, the electrical resistivity of Cu films deposited from the aged solution increased due to a decrease in the grain sizes.

Original languageEnglish
Pages (from-to)85-91
Number of pages7
JournalJournal of Electroanalytical Chemistry
Volume714-715
DOIs
StatePublished - 1 Feb 2014
Externally publishedYes

Keywords

  • Additive
  • Copper electrodeposition
  • Cyclic voltammetry stripping
  • Decomposition
  • Poly(ethylene glycol-propylene glycol)

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