Damage-free design of megasonic waveguide for single wafer process

Y. K. Ahn; D. H. Yoo; J. C. Yang; A. Kulkarni; J. I. Kim; H. M. Lee; T. Kim

doi:10.1149/1.3202667

Damage-free design of megasonic waveguide for single wafer process

Y. K. Ahn, D. H. Yoo, J. C. Yang, A. Kulkarni, J. I. Kim, H. M. Lee, T. Kim

Department of Mechanical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

2 Scopus citations

Abstract

Megasonic cleaning process is routinely used in the semiconductor industry for removal of contaminant particles from wafer surfaces. Effective cleaning is achieved through proper choice of chemical solutions, transducer power density and frequency of the acoustic field. Two principal mechanisms, namely acoustic streaming and acoustic cavitation, are considered to be responsible for the removal of particles from a contaminated surface. In this study, we designed two megasonic waveguides, indirect type and direct type, for a comparative study of cleaning wafers with 70 nm poly-Si pattern. We observed that the indirect type waveguide has more uniform megasonic energy which is transferred to the wafer. Also bubble size was smaller than conventional direct type. The conventional direct type waveguide is better in energy transfer, but can cause structural damages on the wafer.

Original language	English
Title of host publication	ECS Transactions - Cleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing 11
Publisher	Electrochemical Society Inc.
Pages	303-309
Number of pages	7
Edition	5
ISBN (Electronic)	9781607680925
ISBN (Print)	9781566777421
DOIs	https://doi.org/10.1149/1.3202667
State	Published - 2009
Event	11th International Symposium on Semiconductor Cleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing - 216th ECS Meeting - Vienna, Austria Duration: 4 Oct 2009 → 9 Oct 2009

Publication series

Name	ECS Transactions
Number	5
Volume	25
ISSN (Print)	1938-5862
ISSN (Electronic)	1938-6737

Conference

Conference	11th International Symposium on Semiconductor Cleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing - 216th ECS Meeting
Country/Territory	Austria
City	Vienna
Period	4/10/09 → 9/10/09

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10.1149/1.3202667

Cite this

Ahn, Y. K., Yoo, D. H., Yang, J. C., Kulkarni, A., Kim, J. I., Lee, H. M., & Kim, T. (2009). Damage-free design of megasonic waveguide for single wafer process. In ECS Transactions - Cleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing 11 (5 ed., pp. 303-309). (ECS Transactions; Vol. 25, No. 5). Electrochemical Society Inc.. https://doi.org/10.1149/1.3202667

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title = "Damage-free design of megasonic waveguide for single wafer process",

abstract = "Megasonic cleaning process is routinely used in the semiconductor industry for removal of contaminant particles from wafer surfaces. Effective cleaning is achieved through proper choice of chemical solutions, transducer power density and frequency of the acoustic field. Two principal mechanisms, namely acoustic streaming and acoustic cavitation, are considered to be responsible for the removal of particles from a contaminated surface. In this study, we designed two megasonic waveguides, indirect type and direct type, for a comparative study of cleaning wafers with 70 nm poly-Si pattern. We observed that the indirect type waveguide has more uniform megasonic energy which is transferred to the wafer. Also bubble size was smaller than conventional direct type. The conventional direct type waveguide is better in energy transfer, but can cause structural damages on the wafer.",

author = "Ahn, \{Y. K.\} and Yoo, \{D. H.\} and Yang, \{J. C.\} and A. Kulkarni and Kim, \{J. I.\} and Lee, \{H. M.\} and T. Kim",

year = "2009",

doi = "10.1149/1.3202667",

language = "English",

isbn = "9781566777421",

series = "ECS Transactions",

publisher = "Electrochemical Society Inc.",

number = "5",

pages = "303--309",

booktitle = "ECS Transactions - Cleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing 11",

edition = "5",

note = "11th International Symposium on Semiconductor Cleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing - 216th ECS Meeting ; Conference date: 04-10-2009 Through 09-10-2009",

}

Ahn, YK, Yoo, DH, Yang, JC, Kulkarni, A, Kim, JI, Lee, HM & Kim, T 2009, Damage-free design of megasonic waveguide for single wafer process. in ECS Transactions - Cleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing 11. 5 edn, ECS Transactions, no. 5, vol. 25, Electrochemical Society Inc., pp. 303-309, 11th International Symposium on Semiconductor Cleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing - 216th ECS Meeting, Vienna, Austria, 4/10/09. https://doi.org/10.1149/1.3202667

Damage-free design of megasonic waveguide for single wafer process. / Ahn, Y. K.; Yoo, D. H.; Yang, J. C. et al.
ECS Transactions - Cleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing 11. 5. ed. Electrochemical Society Inc., 2009. p. 303-309 (ECS Transactions; Vol. 25, No. 5).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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T1 - Damage-free design of megasonic waveguide for single wafer process

AU - Ahn, Y. K.

AU - Yoo, D. H.

AU - Yang, J. C.

AU - Kulkarni, A.

AU - Kim, J. I.

AU - Lee, H. M.

AU - Kim, T.

PY - 2009

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N2 - Megasonic cleaning process is routinely used in the semiconductor industry for removal of contaminant particles from wafer surfaces. Effective cleaning is achieved through proper choice of chemical solutions, transducer power density and frequency of the acoustic field. Two principal mechanisms, namely acoustic streaming and acoustic cavitation, are considered to be responsible for the removal of particles from a contaminated surface. In this study, we designed two megasonic waveguides, indirect type and direct type, for a comparative study of cleaning wafers with 70 nm poly-Si pattern. We observed that the indirect type waveguide has more uniform megasonic energy which is transferred to the wafer. Also bubble size was smaller than conventional direct type. The conventional direct type waveguide is better in energy transfer, but can cause structural damages on the wafer.

AB - Megasonic cleaning process is routinely used in the semiconductor industry for removal of contaminant particles from wafer surfaces. Effective cleaning is achieved through proper choice of chemical solutions, transducer power density and frequency of the acoustic field. Two principal mechanisms, namely acoustic streaming and acoustic cavitation, are considered to be responsible for the removal of particles from a contaminated surface. In this study, we designed two megasonic waveguides, indirect type and direct type, for a comparative study of cleaning wafers with 70 nm poly-Si pattern. We observed that the indirect type waveguide has more uniform megasonic energy which is transferred to the wafer. Also bubble size was smaller than conventional direct type. The conventional direct type waveguide is better in energy transfer, but can cause structural damages on the wafer.

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M3 - Conference contribution

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BT - ECS Transactions - Cleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing 11

PB - Electrochemical Society Inc.

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Y2 - 4 October 2009 through 9 October 2009

ER -

Damage-free design of megasonic waveguide for single wafer process

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