TY - GEN
T1 - Cu/SnAg Pillar Bump Joints on Ni-Less Surface Finish in Laser Assisted Bonding (LAB)
AU - Han, Sang Eun
AU - Han, Seonghui
AU - Lee, Tae Young
AU - Lee, Hoo Jeong
AU - Yoo, Sehoon
N1 - Publisher Copyright:
© 2024 Japan Institute of Electronics Packaging.
PY - 2024
Y1 - 2024
N2 - In this study, interconnects between Ni-less surface-finished Cu pads and Cu/SnAg pillar bumps were formed via a laser assisted bonding (LAB) and the bond properties of the interconnects were evaluated. The LAB process is influenced by the time and power conditions of the laser, affecting the bonding quality and mechanical strength. Under the optimized conditions of the LAB process, it exhibited a higher bonding strength compared to the TCB process. The impact of the Ni-less surface finish on the LAB joint quality was also analyzed.
AB - In this study, interconnects between Ni-less surface-finished Cu pads and Cu/SnAg pillar bumps were formed via a laser assisted bonding (LAB) and the bond properties of the interconnects were evaluated. The LAB process is influenced by the time and power conditions of the laser, affecting the bonding quality and mechanical strength. Under the optimized conditions of the LAB process, it exhibited a higher bonding strength compared to the TCB process. The impact of the Ni-less surface finish on the LAB joint quality was also analyzed.
KW - direct palladium immersion gold (DPIG)
KW - laser-assisted bonding
KW - Ni-less surface finish
KW - thermo-compression bonding
KW - ultra-fine pitch bonding
UR - https://www.scopus.com/pages/publications/85195445297
U2 - 10.23919/ICEP61562.2024.10535432
DO - 10.23919/ICEP61562.2024.10535432
M3 - Conference contribution
AN - SCOPUS:85195445297
T3 - 2024 International Conference on Electronics Packaging, ICEP 2024
SP - 85
EP - 86
BT - 2024 International Conference on Electronics Packaging, ICEP 2024
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 23rd International Conference on Electronics Packaging, ICEP 2024
Y2 - 17 April 2024 through 20 April 2024
ER -