Abstract
This study examined the crystallization behavior of electroless Ni-P UBM with an medium phosphorous content (~15 at%) induced by a single and step heat treatment using in-situ transmission electron microscopy (TEM). Different heat treatment processes affected the crystallization behavior of electroless Ni-P UBM. After single heat treatment at 300°C for 60 min, the electroless Ni-P UBM contained Ni and Ni3P. In addition to Ni and Ni3P, more complex Ni-P compounds, such as Ni12P5 and Ni5P2 formed in the electroless Ni-P UBM resulting from a step heat treatment at 150 C for 60 nun followed by 300̈C for 60 nun.
| Original language | English |
|---|---|
| Pages (from-to) | 1878-1882 |
| Number of pages | 5 |
| Journal | Materials Transactions |
| Volume | 51 |
| Issue number | 10 |
| DOIs | |
| State | Published - Oct 2010 |
Keywords
- Electroless nickel-phosphorous
- In-situ transmission electron microscopy (TEM)
- Under bump metallization