Abstract
The physical and electrical effects caused by interfacial reactions of HfO 2 on Si-passivated GaAs were investigated by various methods. The results showed that the Si layer decreases the diffusion and formation of GaO. Moreover, post-nitridation in HfO 2 /Si/GaAs significantly reduced the formation of AsO and GaO. The depth profiling data showed that two separated layered structures were formed with HfO 2 and a mixture of HfO 2 and SiO 2 after the annealing process. The crystalline structure and formation of GaO in the film affect the band offsets between GaAs and the high-k HfO 2 dielectric. Moreover, the Si passivation effectively suppressed the interfacial defects caused by GaO diffusion during the annealing treatment. The nitridation cause As diffusion to oxygen vacancy of HfO 2 result in the increase of the interfacial defect.
| Original language | English |
|---|---|
| Pages (from-to) | 375-381 |
| Number of pages | 7 |
| Journal | Applied Surface Science |
| Volume | 283 |
| DOIs | |
| State | Published - 15 Oct 2013 |
Keywords
- Atomic layer deposition
- GaAs
- High-k dielectric
- Passivation