Control of interfacial reaction layers formed in Sn-3.5Ag-0.7Cu/electroless Ni-P solder joints

Han Byul Kang; Jee Hwan Bae; Jae Wook Lee; Min Ho Park; Young Chul Lee; Jeong Won Yoon; Seung Boo Jung; Cheol Woong Yang

doi:10.1016/j.scriptamat.2008.10.017

Control of interfacial reaction layers formed in Sn-3.5Ag-0.7Cu/electroless Ni-P solder joints

Han Byul Kang, Jee Hwan Bae, Jae Wook Lee, Min Ho Park, Young Chul Lee, Jeong Won Yoon, Seung Boo Jung, Cheol Woong Yang

Department of Advanced Materials Science and Engineering

Sungkyunkwan University

Research output: Contribution to journal › Article › peer-review

32 Scopus citations

Abstract

This study investigated a method for controlling the interfacial reaction between a Sn-3.5Ag-0.7Cu (wt.%) solder and an electroless nickel-immersion gold-plated Cu substrate through heat treatment. The interfacial reaction layer was controlled by heat treating of the electroless Ni-P plated layer. By applying a heat treatment, the thickness of the reaction layer (intermetallic compounds, P-rich Ni layer) was observed to be reduced. The formation of Ni₂SnP, which significantly affects the mechanical reliability of solder joints, was suppressed.

Original language	English
Pages (from-to)	257-260
Number of pages	4
Journal	Scripta Materialia
Volume	60
Issue number	4
DOIs	https://doi.org/10.1016/j.scriptamat.2008.10.017
State	Published - Feb 2009

Keywords

Heat treatment
Soldering
Transmission electron microscopy

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10.1016/j.scriptamat.2008.10.017

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title = "Control of interfacial reaction layers formed in Sn-3.5Ag-0.7Cu/electroless Ni-P solder joints",

abstract = "This study investigated a method for controlling the interfacial reaction between a Sn-3.5Ag-0.7Cu (wt.\%) solder and an electroless nickel-immersion gold-plated Cu substrate through heat treatment. The interfacial reaction layer was controlled by heat treating of the electroless Ni-P plated layer. By applying a heat treatment, the thickness of the reaction layer (intermetallic compounds, P-rich Ni layer) was observed to be reduced. The formation of Ni2SnP, which significantly affects the mechanical reliability of solder joints, was suppressed.",

keywords = "Heat treatment, Soldering, Transmission electron microscopy",

author = "Kang, \{Han Byul\} and Bae, \{Jee Hwan\} and Lee, \{Jae Wook\} and Park, \{Min Ho\} and Lee, \{Young Chul\} and Yoon, \{Jeong Won\} and Jung, \{Seung Boo\} and Yang, \{Cheol Woong\}",

year = "2009",

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language = "English",

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T1 - Control of interfacial reaction layers formed in Sn-3.5Ag-0.7Cu/electroless Ni-P solder joints

AU - Kang, Han Byul

AU - Bae, Jee Hwan

AU - Lee, Jae Wook

AU - Park, Min Ho

AU - Lee, Young Chul

AU - Yoon, Jeong Won

AU - Jung, Seung Boo

AU - Yang, Cheol Woong

PY - 2009/2

Y1 - 2009/2

N2 - This study investigated a method for controlling the interfacial reaction between a Sn-3.5Ag-0.7Cu (wt.%) solder and an electroless nickel-immersion gold-plated Cu substrate through heat treatment. The interfacial reaction layer was controlled by heat treating of the electroless Ni-P plated layer. By applying a heat treatment, the thickness of the reaction layer (intermetallic compounds, P-rich Ni layer) was observed to be reduced. The formation of Ni2SnP, which significantly affects the mechanical reliability of solder joints, was suppressed.

AB - This study investigated a method for controlling the interfacial reaction between a Sn-3.5Ag-0.7Cu (wt.%) solder and an electroless nickel-immersion gold-plated Cu substrate through heat treatment. The interfacial reaction layer was controlled by heat treating of the electroless Ni-P plated layer. By applying a heat treatment, the thickness of the reaction layer (intermetallic compounds, P-rich Ni layer) was observed to be reduced. The formation of Ni2SnP, which significantly affects the mechanical reliability of solder joints, was suppressed.

KW - Heat treatment

KW - Soldering

KW - Transmission electron microscopy

UR - https://www.scopus.com/pages/publications/56249141086

U2 - 10.1016/j.scriptamat.2008.10.017

DO - 10.1016/j.scriptamat.2008.10.017

M3 - Article

AN - SCOPUS:56249141086

SN - 1359-6462

VL - 60

SP - 257

EP - 260

JO - Scripta Materialia

JF - Scripta Materialia

IS - 4

ER -

Control of interfacial reaction layers formed in Sn-3.5Ag-0.7Cu/electroless Ni-P solder joints

Abstract

Keywords

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