Control of interfacial reaction layers formed in Sn-3.5Ag-0.7Cu/electroless Ni-P solder joints

Han Byul Kang; Jee Hwan Bae; Jae Wook Lee; Min Ho Park; Young Chul Lee; Jeong Won Yoon; Seung Boo Jung; Cheol Woong Yang

doi:10.1016/j.scriptamat.2008.10.017

Control of interfacial reaction layers formed in Sn-3.5Ag-0.7Cu/electroless Ni-P solder joints

Han Byul Kang
, Jee Hwan Bae
, Jae Wook Lee
, Min Ho Park
, Young Chul Lee
, Jeong Won Yoon
, Seung Boo Jung
, Cheol Woong Yang

Department of Advanced Materials Science and Engineering

Sungkyunkwan University

Research output: Contribution to journal › Article › peer-review

32 Scopus citations

Abstract

This study investigated a method for controlling the interfacial reaction between a Sn-3.5Ag-0.7Cu (wt.%) solder and an electroless nickel-immersion gold-plated Cu substrate through heat treatment. The interfacial reaction layer was controlled by heat treating of the electroless Ni-P plated layer. By applying a heat treatment, the thickness of the reaction layer (intermetallic compounds, P-rich Ni layer) was observed to be reduced. The formation of Ni₂SnP, which significantly affects the mechanical reliability of solder joints, was suppressed.

Original language	English
Pages (from-to)	257-260
Number of pages	4
Journal	Scripta Materialia
Volume	60
Issue number	4
DOIs	https://doi.org/10.1016/j.scriptamat.2008.10.017
State	Published - Feb 2009

Keywords

Heat treatment
Soldering
Transmission electron microscopy

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10.1016/j.scriptamat.2008.10.017

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@article{f0806c3917c64d5eb469fdd4cc9128c1,

title = "Control of interfacial reaction layers formed in Sn-3.5Ag-0.7Cu/electroless Ni-P solder joints",

abstract = "This study investigated a method for controlling the interfacial reaction between a Sn-3.5Ag-0.7Cu (wt.\%) solder and an electroless nickel-immersion gold-plated Cu substrate through heat treatment. The interfacial reaction layer was controlled by heat treating of the electroless Ni-P plated layer. By applying a heat treatment, the thickness of the reaction layer (intermetallic compounds, P-rich Ni layer) was observed to be reduced. The formation of Ni2SnP, which significantly affects the mechanical reliability of solder joints, was suppressed.",

keywords = "Heat treatment, Soldering, Transmission electron microscopy",

author = "Kang, \{Han Byul\} and Bae, \{Jee Hwan\} and Lee, \{Jae Wook\} and Park, \{Min Ho\} and Lee, \{Young Chul\} and Yoon, \{Jeong Won\} and Jung, \{Seung Boo\} and Yang, \{Cheol Woong\}",

year = "2009",

month = feb,

doi = "10.1016/j.scriptamat.2008.10.017",

language = "English",

volume = "60",

pages = "257--260",

journal = "Scripta Materialia",

issn = "1359-6462",

publisher = "Acta Materialia Inc",

number = "4",

}

TY - JOUR

T1 - Control of interfacial reaction layers formed in Sn-3.5Ag-0.7Cu/electroless Ni-P solder joints

AU - Kang, Han Byul

AU - Bae, Jee Hwan

AU - Lee, Jae Wook

AU - Park, Min Ho

AU - Lee, Young Chul

AU - Yoon, Jeong Won

AU - Jung, Seung Boo

AU - Yang, Cheol Woong

PY - 2009/2

Y1 - 2009/2

N2 - This study investigated a method for controlling the interfacial reaction between a Sn-3.5Ag-0.7Cu (wt.%) solder and an electroless nickel-immersion gold-plated Cu substrate through heat treatment. The interfacial reaction layer was controlled by heat treating of the electroless Ni-P plated layer. By applying a heat treatment, the thickness of the reaction layer (intermetallic compounds, P-rich Ni layer) was observed to be reduced. The formation of Ni2SnP, which significantly affects the mechanical reliability of solder joints, was suppressed.

AB - This study investigated a method for controlling the interfacial reaction between a Sn-3.5Ag-0.7Cu (wt.%) solder and an electroless nickel-immersion gold-plated Cu substrate through heat treatment. The interfacial reaction layer was controlled by heat treating of the electroless Ni-P plated layer. By applying a heat treatment, the thickness of the reaction layer (intermetallic compounds, P-rich Ni layer) was observed to be reduced. The formation of Ni2SnP, which significantly affects the mechanical reliability of solder joints, was suppressed.

KW - Heat treatment

KW - Soldering

KW - Transmission electron microscopy

UR - https://www.scopus.com/pages/publications/56249141086

U2 - 10.1016/j.scriptamat.2008.10.017

DO - 10.1016/j.scriptamat.2008.10.017

M3 - Article

AN - SCOPUS:56249141086

SN - 1359-6462

VL - 60

SP - 257

EP - 260

JO - Scripta Materialia

JF - Scripta Materialia

IS - 4

ER -

Control of interfacial reaction layers formed in Sn-3.5Ag-0.7Cu/electroless Ni-P solder joints

Abstract

Keywords

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