Abstract
Abstract: Previous studies have reported on the mechanical robustness and chemical stability of flexible amorphous indium gallium zinc oxide (a-IGZO) thin-film transistors (TFTs) on plastic substrates both in flat and curved states. In this study, we investigate how the polyimide (PI) substrate affects hydrogen concentration in the a-IGZO layer, which subsequently influences the device performance and stability under bias-temperature-stress. Hydrogen increases the carrier concentration in the active layer, but it also electrically deactivates intrinsic defects depending on its concentration. The influence of hydrogen varies between the TFTs fabricated on a glass substrate to those on a PI substrate. Hydrogen concentration is 5% lower in devices on a PI substrate after annealing, which increases the hysteresis characteristics from 0.22 to 0.55 V and also the threshold voltage shift under positive bias temperature stress by 2 × compared to the devices on a glass substrate. Hence, the analysis and control of hydrogen flux is crucial to maintaining good device performance and stability of a-IGZO TFTs. Graphical Abstract: [Figure not available: see fulltext.].
| Original language | English |
|---|---|
| Pages (from-to) | 749-754 |
| Number of pages | 6 |
| Journal | Electronic Materials Letters |
| Volume | 14 |
| Issue number | 6 |
| DOIs | |
| State | Published - 1 Nov 2018 |
| Externally published | Yes |
Keywords
- Flexible
- Hydrogen
- InGaZnO
- Polyimide
- Thin film transistor
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