Communication - Effect of Hydrogen Water on Ceria Abrasive Removal in Post-CMP Cleaning

Seokjun Hong; Sang Hyeon Park; Chaitanya Kanade; Jaewon Lee; Pengzhan Liu; Inkoo Lee; Hyunho Seok; Taesung Kim

doi:10.1149/2162-8777/ab902c

Communication - Effect of Hydrogen Water on Ceria Abrasive Removal in Post-CMP Cleaning

Seokjun Hong
, Sang Hyeon Park
, Chaitanya Kanade
, Jaewon Lee
, Pengzhan Liu
, Inkoo Lee
, Hyunho Seok
, Taesung Kim

Department of Mechanical Engineering

Sungkyunkwan University

Research output: Contribution to journal › Article › peer-review

16 Scopus citations

Abstract

In the present study, hydrogen water was applied to ceria abrasive removal in post-CMP cleaning. The surface of the ceria abrasive was reduced by the hydrogen water from the Ce⁴⁺ to Ce³⁺ state. Reduction of the ceria abrasive can weaken the bonding between ceria and the SiO₂ wafer surface. X-ray photoelectron spectroscopy (XPS) and UV-visible observations were utilized to reveal the reduction from Ce⁴⁺ to Ce³⁺ by hydrogen water. Thus, the remaining ceria particles and Ce-ion concentrations were reduced by 70% and 63%, respectively.

Original language	English
Article number	044012
Journal	ECS Journal of Solid State Science and Technology
Volume	9
Issue number	4
DOIs	https://doi.org/10.1149/2162-8777/ab902c
State	Published - 5 Jan 2020

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@article{2b54e8a6cbc94767b6af74d0226e3820,

title = "Communication - Effect of Hydrogen Water on Ceria Abrasive Removal in Post-CMP Cleaning",

abstract = "In the present study, hydrogen water was applied to ceria abrasive removal in post-CMP cleaning. The surface of the ceria abrasive was reduced by the hydrogen water from the Ce4+ to Ce3+ state. Reduction of the ceria abrasive can weaken the bonding between ceria and the SiO2 wafer surface. X-ray photoelectron spectroscopy (XPS) and UV-visible observations were utilized to reveal the reduction from Ce4+ to Ce3+ by hydrogen water. Thus, the remaining ceria particles and Ce-ion concentrations were reduced by 70\% and 63\%, respectively.",

author = "Seokjun Hong and Park, \{Sang Hyeon\} and Chaitanya Kanade and Jaewon Lee and Pengzhan Liu and Inkoo Lee and Hyunho Seok and Taesung Kim",

note = "Publisher Copyright: {\textcopyright} 2020 The Electrochemical Society ({"}ECS{"}). Published on behalf of ECS by IOP Publishing Limited.",

year = "2020",

month = jan,

day = "5",

doi = "10.1149/2162-8777/ab902c",

language = "English",

volume = "9",

journal = "ECS Journal of Solid State Science and Technology",

issn = "2162-8769",

publisher = "Electrochemical Society Inc.",

number = "4",

}

TY - JOUR

T1 - Communication - Effect of Hydrogen Water on Ceria Abrasive Removal in Post-CMP Cleaning

AU - Hong, Seokjun

AU - Park, Sang Hyeon

AU - Kanade, Chaitanya

AU - Lee, Jaewon

AU - Liu, Pengzhan

AU - Lee, Inkoo

AU - Seok, Hyunho

AU - Kim, Taesung

PY - 2020/1/5

Y1 - 2020/1/5

N2 - In the present study, hydrogen water was applied to ceria abrasive removal in post-CMP cleaning. The surface of the ceria abrasive was reduced by the hydrogen water from the Ce4+ to Ce3+ state. Reduction of the ceria abrasive can weaken the bonding between ceria and the SiO2 wafer surface. X-ray photoelectron spectroscopy (XPS) and UV-visible observations were utilized to reveal the reduction from Ce4+ to Ce3+ by hydrogen water. Thus, the remaining ceria particles and Ce-ion concentrations were reduced by 70% and 63%, respectively.

AB - In the present study, hydrogen water was applied to ceria abrasive removal in post-CMP cleaning. The surface of the ceria abrasive was reduced by the hydrogen water from the Ce4+ to Ce3+ state. Reduction of the ceria abrasive can weaken the bonding between ceria and the SiO2 wafer surface. X-ray photoelectron spectroscopy (XPS) and UV-visible observations were utilized to reveal the reduction from Ce4+ to Ce3+ by hydrogen water. Thus, the remaining ceria particles and Ce-ion concentrations were reduced by 70% and 63%, respectively.

UR - https://www.scopus.com/pages/publications/85085247049

U2 - 10.1149/2162-8777/ab902c

DO - 10.1149/2162-8777/ab902c

M3 - Article

AN - SCOPUS:85085247049

SN - 2162-8769

VL - 9

JO - ECS Journal of Solid State Science and Technology

JF - ECS Journal of Solid State Science and Technology

IS - 4

M1 - 044012

ER -

Communication - Effect of Hydrogen Water on Ceria Abrasive Removal in Post-CMP Cleaning

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