TY - JOUR
T1 - Communication - A Novel Method to Improve Cleaning Performance by Removing Small Particles in CMP Slurry
AU - Lee, Jaewon
AU - Park, Sang Hyeon
AU - Hong, Seokjun
AU - Seo, Hyeonmin
AU - Liu, Pengzhan
AU - Kim, Eungchul
AU - Kim, Taesung
N1 - Publisher Copyright:
© 2021 The Electrochemical Society ("ECS"). Published on behalf of ECS by IOP Publishing Limited.
PY - 2021/2
Y1 - 2021/2
N2 - In the present study, a separation system with a tangential flow filter (TFF) was applied to reduce the number of small ceria particles in chemical mechanical polishing slurry. The small ceria particles were reduced by 30.7% via the TFF system, and slurry properties of particle mean diameter, pH, zeta potential, and solids concentration were maintained. There was no significant difference in removal rate between original and TFF-treated slurry. In addition, the cleaning efficiency with the TFF system was improved by 34.7% compared to that without the TFF system.
AB - In the present study, a separation system with a tangential flow filter (TFF) was applied to reduce the number of small ceria particles in chemical mechanical polishing slurry. The small ceria particles were reduced by 30.7% via the TFF system, and slurry properties of particle mean diameter, pH, zeta potential, and solids concentration were maintained. There was no significant difference in removal rate between original and TFF-treated slurry. In addition, the cleaning efficiency with the TFF system was improved by 34.7% compared to that without the TFF system.
UR - https://www.scopus.com/pages/publications/85101577664
U2 - 10.1149/2162-8777/abe1d6
DO - 10.1149/2162-8777/abe1d6
M3 - Article
AN - SCOPUS:85101577664
SN - 2162-8769
VL - 10
JO - ECS Journal of Solid State Science and Technology
JF - ECS Journal of Solid State Science and Technology
IS - 2
M1 - 024001
ER -