Abstract
This letter presents a low-tempcrature process to fabricate Schottky-barrier silicide source/drain transistors (SSDTs) with high-? gate dielectric and metal gate. For p-channel SSDTs (P-SSDT) using PtSi sourece/drain (S/D), excellent electrical performance of Ion/Ioff~ 107- 108and subthreshold slope of 66 mV/dec have been achieved. For n-channcl SSDTs (N-SSDTs) using DySi2-xS/D, Ion/Ioff can reach ~ 105at Vdsof 0.2 V with two subthrcshold slopes of 80 and 340 mV/dec. The low-tcm-perature process relaxes the thermal budget of high-? dielectric and metal-gate materials to be used in the future generation CMOS technology.
| Original language | English |
|---|---|
| Title of host publication | Selected Semiconductor Research |
| Publisher | Imperial College Press |
| Pages | 330-332 |
| Number of pages | 3 |
| ISBN (Electronic) | 9781848164079 |
| ISBN (Print) | 9781848164062 |
| DOIs | |
| State | Published - 1 Jan 2011 |
| Externally published | Yes |
Keywords
- High-?
- Metal gate
- MOSFET
- Schottky
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