Chemical interaction and adhesion characteristics at the interface of metals (Cu, Ta) and low-k cyclohexane-based plasma polymer (CHexPP) films

K. J. Kim; K. S. Kim; N. E. Lee; J. Choi; D. Jung

doi:10.1116/1.1340658

Chemical interaction and adhesion characteristics at the interface of metals (Cu, Ta) and low-k cyclohexane-based plasma polymer (CHexPP) films

K. J. Kim, K. S. Kim, N. E. Lee, J. Choi, D. Jung

Department of Advanced Materials Science and Engineering

Sungkyunkwan University

Research output: Contribution to journal › Article › peer-review

8 Scopus citations

Abstract

Chemical interactions and adhesion characteristics at the interface between metals and plasma-treated cyclohexane-based plasma polymer films were investigated. Formation of new binding sites at the interface by plasma treatments was observed from X-ray photoelectron spectroscopy (XPS) analysis. The measurement data of adhesion properties obtained by tape and scratch test showed an increase in adhesion strengths of metals on improvement of bonding of metals with newly formed functional groups on the surface of plasma-treated films. Oxygen plasma treatment and thermal annealing were found to increase the adhesion property of cyclohexane films in combination with copper.

Original language	English
Pages (from-to)	1072-1077
Number of pages	6
Journal	Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Volume	19
Issue number	4
DOIs	https://doi.org/10.1116/1.1340658
State	Published - Jul 2001

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10.1116/1.1340658

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title = "Chemical interaction and adhesion characteristics at the interface of metals (Cu, Ta) and low-k cyclohexane-based plasma polymer (CHexPP) films",

abstract = "Chemical interactions and adhesion characteristics at the interface between metals and plasma-treated cyclohexane-based plasma polymer films were investigated. Formation of new binding sites at the interface by plasma treatments was observed from X-ray photoelectron spectroscopy (XPS) analysis. The measurement data of adhesion properties obtained by tape and scratch test showed an increase in adhesion strengths of metals on improvement of bonding of metals with newly formed functional groups on the surface of plasma-treated films. Oxygen plasma treatment and thermal annealing were found to increase the adhesion property of cyclohexane films in combination with copper.",

author = "Kim, \{K. J.\} and Kim, \{K. S.\} and Lee, \{N. E.\} and J. Choi and D. Jung",

year = "2001",

month = jul,

doi = "10.1116/1.1340658",

language = "English",

volume = "19",

pages = "1072--1077",

journal = "Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films",

issn = "0734-2101",

publisher = "AVS Science and Technology Society",

number = "4",

}

Chemical interaction and adhesion characteristics at the interface of metals (Cu, Ta) and low-k cyclohexane-based plasma polymer (CHexPP) films. / Kim, K. J.; Kim, K. S.; Lee, N. E. et al.
In: Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films, Vol. 19, No. 4, 07.2001, p. 1072-1077.

Research output: Contribution to journal › Article › peer-review

TY - JOUR

T1 - Chemical interaction and adhesion characteristics at the interface of metals (Cu, Ta) and low-k cyclohexane-based plasma polymer (CHexPP) films

AU - Kim, K. J.

AU - Kim, K. S.

AU - Lee, N. E.

AU - Choi, J.

AU - Jung, D.

PY - 2001/7

Y1 - 2001/7

N2 - Chemical interactions and adhesion characteristics at the interface between metals and plasma-treated cyclohexane-based plasma polymer films were investigated. Formation of new binding sites at the interface by plasma treatments was observed from X-ray photoelectron spectroscopy (XPS) analysis. The measurement data of adhesion properties obtained by tape and scratch test showed an increase in adhesion strengths of metals on improvement of bonding of metals with newly formed functional groups on the surface of plasma-treated films. Oxygen plasma treatment and thermal annealing were found to increase the adhesion property of cyclohexane films in combination with copper.

AB - Chemical interactions and adhesion characteristics at the interface between metals and plasma-treated cyclohexane-based plasma polymer films were investigated. Formation of new binding sites at the interface by plasma treatments was observed from X-ray photoelectron spectroscopy (XPS) analysis. The measurement data of adhesion properties obtained by tape and scratch test showed an increase in adhesion strengths of metals on improvement of bonding of metals with newly formed functional groups on the surface of plasma-treated films. Oxygen plasma treatment and thermal annealing were found to increase the adhesion property of cyclohexane films in combination with copper.

UR - https://www.scopus.com/pages/publications/0035393108

U2 - 10.1116/1.1340658

DO - 10.1116/1.1340658

M3 - Article

AN - SCOPUS:0035393108

SN - 0734-2101

VL - 19

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JO - Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

JF - Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

IS - 4

ER -

Chemical interaction and adhesion characteristics at the interface of metals (Cu, Ta) and low-k cyclohexane-based plasma polymer (CHexPP) films

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