Characterization of ternary Ni2SnP layer in Sn-3.5Ag-0.7Cu/ electroless Ni (P) solder joint

Han Byul Kang; Jee Hwan Bae; Jeong Won Yoon; Seung Boo Jung; Jongwoo Park; Cheol Woong Yang

doi:10.1016/j.scriptamat.2010.08.024

Characterization of ternary Ni₂SnP layer in Sn-3.5Ag-0.7Cu/ electroless Ni (P) solder joint

Han Byul Kang
, Jee Hwan Bae
, Jeong Won Yoon
, Seung Boo Jung
, Jongwoo Park
, Cheol Woong Yang

Department of Advanced Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

27 Scopus citations

Abstract

This study examined the ternary Ni₂SnP layer in Sn-3.5Ag-0.7Cu/electroless Ni (P) solder joints using in situ transmission electron microscopy (TEM). TEM confirmed the formation of an Ni₂P phase underneath the ternary Ni₂SnP after reflowing. We can directly observe the Sn diffused into Ni₂P to form Ni₂SnP during annealing in TEM. These results suggested that the ternary Ni₂SnP forms through the diffusion of Sn into Ni₂P. In addition, small Kirkendall voids were newly formed in the ternary Ni₂SnP layer after annealing in TEM.

Original language	English
Pages (from-to)	1108-1111
Number of pages	4
Journal	Scripta Materialia
Volume	63
Issue number	11
DOIs	https://doi.org/10.1016/j.scriptamat.2010.08.024
State	Published - Nov 2010

Keywords

Diffusion
In situ TEM
Kirkendall void
Lead-free solder
Ternary Ni-Sn-P

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10.1016/j.scriptamat.2010.08.024

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title = "Characterization of ternary Ni2SnP layer in Sn-3.5Ag-0.7Cu/ electroless Ni (P) solder joint",

abstract = "This study examined the ternary Ni2SnP layer in Sn-3.5Ag-0.7Cu/electroless Ni (P) solder joints using in situ transmission electron microscopy (TEM). TEM confirmed the formation of an Ni2P phase underneath the ternary Ni2SnP after reflowing. We can directly observe the Sn diffused into Ni2P to form Ni2SnP during annealing in TEM. These results suggested that the ternary Ni2SnP forms through the diffusion of Sn into Ni2P. In addition, small Kirkendall voids were newly formed in the ternary Ni2SnP layer after annealing in TEM.",

keywords = "Diffusion, In situ TEM, Kirkendall void, Lead-free solder, Ternary Ni-Sn-P",

author = "Kang, \{Han Byul\} and Bae, \{Jee Hwan\} and Yoon, \{Jeong Won\} and Jung, \{Seung Boo\} and Jongwoo Park and Yang, \{Cheol Woong\}",

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doi = "10.1016/j.scriptamat.2010.08.024",

language = "English",

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TY - JOUR

T1 - Characterization of ternary Ni2SnP layer in Sn-3.5Ag-0.7Cu/ electroless Ni (P) solder joint

AU - Kang, Han Byul

AU - Bae, Jee Hwan

AU - Yoon, Jeong Won

AU - Jung, Seung Boo

AU - Park, Jongwoo

AU - Yang, Cheol Woong

PY - 2010/11

Y1 - 2010/11

N2 - This study examined the ternary Ni2SnP layer in Sn-3.5Ag-0.7Cu/electroless Ni (P) solder joints using in situ transmission electron microscopy (TEM). TEM confirmed the formation of an Ni2P phase underneath the ternary Ni2SnP after reflowing. We can directly observe the Sn diffused into Ni2P to form Ni2SnP during annealing in TEM. These results suggested that the ternary Ni2SnP forms through the diffusion of Sn into Ni2P. In addition, small Kirkendall voids were newly formed in the ternary Ni2SnP layer after annealing in TEM.

AB - This study examined the ternary Ni2SnP layer in Sn-3.5Ag-0.7Cu/electroless Ni (P) solder joints using in situ transmission electron microscopy (TEM). TEM confirmed the formation of an Ni2P phase underneath the ternary Ni2SnP after reflowing. We can directly observe the Sn diffused into Ni2P to form Ni2SnP during annealing in TEM. These results suggested that the ternary Ni2SnP forms through the diffusion of Sn into Ni2P. In addition, small Kirkendall voids were newly formed in the ternary Ni2SnP layer after annealing in TEM.

KW - Diffusion

KW - In situ TEM

KW - Kirkendall void

KW - Lead-free solder

KW - Ternary Ni-Sn-P

UR - https://www.scopus.com/pages/publications/77956882551

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DO - 10.1016/j.scriptamat.2010.08.024

M3 - Article

AN - SCOPUS:77956882551

SN - 1359-6462

VL - 63

SP - 1108

EP - 1111

JO - Scripta Materialia

JF - Scripta Materialia

IS - 11

ER -

Characterization of ternary Ni₂SnP layer in Sn-3.5Ag-0.7Cu/ electroless Ni (P) solder joint

Abstract

Keywords

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