Characterization of reliability of printed indium tin oxide thin films

Sung Jei Hong, Jong Woong Kim, Seung Boo Jung

Research output: Contribution to journalArticlepeer-review

1 Scopus citations

Abstract

Recently, decreasing the amount of indium (In) element in the indium tin oxide (ITO) used for transparent conductive oxide (TCO) thin film has become necessary for cost reduction. One possible approach to this problem is using printed ITO thin film instead of sputtered. Previous studies showed potential for printed ITO thin films as the TCO layer. However, nothing has been reported on the reliability of printed ITO thin films. Therefore, in this study, the reliability of printed ITO thin films was characterized. ITO nanoparticle ink was fabricated and printed onto a glass substrate followed by heating at 400 °C. After measurement of the initial values of sheet resistance and optical transmittance of the printed ITO thin films, their reliabilities were characterized with an isothermalisohumidity test for 500 hours at 85 °C and 85% RH, a thermal shock test for 1,000 cycles between 125 °C and -40 °C, and a high temperature storage test for 500 hours at 125 °C. The same properties were investigated after the tests. Printed ITO thin films showed stable properties despite extremely thermal and humid conditions. Sheet resistances of the printed ITO thin films changed slightly from 435 Ω/□ to 735 Ω/□, 507 Ω/□ and 442 Ω/□ after the tests, respectively. Optical transmittances of the printed ITO thin films were slightly changed from 84.74% to 81.86%, 88.03% and 88.26% after the tests, respectively. These test results suggest the stability of printed ITO thin film despite extreme environments.

Original languageEnglish
Pages (from-to)7770-7773
Number of pages4
JournalJournal of Nanoscience and Nanotechnology
Volume13
Issue number11
DOIs
StatePublished - Nov 2013
Externally publishedYes

Keywords

  • Electrical properties
  • High-temperature storage
  • Isothermal-isohumidity
  • Optical properties
  • Printed ITO thin film
  • Reliability
  • Thermal shock

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