Characterization of interfacial reaction layers formed between Sn-3.5Ag solder and electroless Ni-immersion Au-plated Cu substrates
- Han Byul Kang
- , Jee Hwan Bae
- , Jae Wook Lee
- , Min Ho Park
- , Jeong Won Yoon
- , Seung Boo Jung
- , Cheol Woong Yang
Research output: Contribution to journal › Article › peer-review
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