Characteristics of SiO X thin films deposited by atmospheric pressure chemical vapor deposition using a double-discharge system

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Abstract

SiO X thin films were deposited using a gas mixture of hexamethyldisilazane (HMDS)/O 2/He/Ar from a remote-type dielectric barrier discharges (DBD) source, with/without the additional direct-type DBD just above the substrate (double discharge), and the effect of the double discharge on the characteristics of the SiO X thin film was investigated. The increase of HMDS flow rate and the decrease of oxygen flow rate in the gas mixture increased the SiO X-thin-film deposition rate. The improvement of the mechanical properties for SiO X film, in addition to the increase of deposition rate, is believed to be related not only to the higher gas dissociation because of the higher power deposition but also to the lesser recombination of oxygen atoms and dissociated HMDS due to the shorter diffusion length to the substrate.

Original languageEnglish
Pages (from-to)3011-3014
Number of pages4
JournalMaterials Research Bulletin
Volume47
Issue number10
DOIs
StatePublished - Oct 2012

Keywords

  • A. Inorganic compounds
  • A. Oxides
  • B. Plasma deposition
  • D. Mechanical properties

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