Characteristics of Plasma-activated Dielectric Film Surfaces for Direct Wafer Bonding
- Seongmin Son
- , Junhong Min
- , Eunsuk Jung
- , Hoechul Kim
- , Taeyoung Kim
- , Hyungjun Jeon
- , Jinnam Kim
- , Seokho Kim
- , Kwangjin Moon
- , Hoonjoo Na
- , Kihyun Hwang
- , Geun Young Yeom
- Samsung
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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