Abstract
SiOx(CH)yNz films were deposited at room temperature using plasma enhanced chemical vapor deposition (PECVD) with a gas mixture of hexamethyldisilazane [HMDS, Si2NH(CH3) 6]/Ar/N2O. The characteristics of those films with increasing N2O were investigated. When no N2O was used, the film showed organic characteristics with a Si/O composition ratio of 2 and a large concentration of -CHx and N-H in the deposited film. However, with increasing N2O flow rate, oxygen-rich and transparent SiO 2-like inorganic thin films could be obtained with a Si/O composition ratio of 0.5 and a lower -CHx and N-H in the deposited film. By turning on-and-off the N2O gas flow during SiOx(CH) yNz deposition, a multi-layer thin film consisting of an organic Si(CH)x-like film/inorganic SiO2-like thin film, which can be applied to the thin film passivation for organic devices could be successfully deposited
| Original language | English |
|---|---|
| Pages (from-to) | 8430-8434 |
| Number of pages | 5 |
| Journal | Japanese Journal of Applied Physics |
| Volume | 45 |
| Issue number | 10 B |
| DOIs | |
| State | Published - 21 Oct 2006 |
Keywords
- Diffusion barrier
- HMDS
- NO
- PECVD
- SiO