Characteristics of a multilayer SiOx(CH)yN z film deposited by low temperature plasma enhanced chemical vapor deposition using hexamethyldisilazane/Ar/N2O

  • June Hee Lee
  • , Chang Hyun Jeong
  • , Jong Tae Lim
  • , Viktor A. Zavaleyev
  • , Se Jin Kyung
  • , Geun Young Yeom

Research output: Contribution to journalArticlepeer-review

8 Scopus citations

Abstract

SiOx(CH)yNz films were deposited at room temperature using plasma enhanced chemical vapor deposition (PECVD) with a gas mixture of hexamethyldisilazane [HMDS, Si2NH(CH3) 6]/Ar/N2O. The characteristics of those films with increasing N2O were investigated. When no N2O was used, the film showed organic characteristics with a Si/O composition ratio of 2 and a large concentration of -CHx and N-H in the deposited film. However, with increasing N2O flow rate, oxygen-rich and transparent SiO 2-like inorganic thin films could be obtained with a Si/O composition ratio of 0.5 and a lower -CHx and N-H in the deposited film. By turning on-and-off the N2O gas flow during SiOx(CH) yNz deposition, a multi-layer thin film consisting of an organic Si(CH)x-like film/inorganic SiO2-like thin film, which can be applied to the thin film passivation for organic devices could be successfully deposited

Original languageEnglish
Pages (from-to)8430-8434
Number of pages5
JournalJapanese Journal of Applied Physics
Volume45
Issue number10 B
DOIs
StatePublished - 21 Oct 2006

Keywords

  • Diffusion barrier
  • HMDS
  • NO
  • PECVD
  • SiO

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