Artificial Intelligence-Based Warpage Prediction Model for Accelerating Thermo-Mechanical Simulation in Advanced Packaging
- Jungeon Lee
- , Sun Woo Lee
- , Taek Soo Kim
- , Daeil Kwon
- Sungkyunkwan University
- Korea Advanced Institute of Science and Technology
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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