ArF photoresist deformation in dual frequency superimposed capacitively coupled plasma (DFS-CCP) with different frequency combinations

Engineering

• Photoresist 100%
• Flow Velocity 100%
• Flow Rate 100%
• Etch Rate 33%
• Atomic Force Microscopy 33%
• Flux Density 33%
• Ion Implantation 33%
• Ion Energy 33%
• Plasma Density 33%
• Field-Emission Scanning Electron Microscopy 33%
• Process Parameter 33%
• Frequency Source 33%
• Inflow Rate 33%
• Power Ratio 33%

Material Science

• Density 100%
• Surface Roughness 50%
• Atomic Force Microscopy 50%
• Morphology 50%
• Ion Bombardment 50%
• Field Emission Scanning Electron Microscopy 50%
• Plasma Density 50%

Physics

• Flow Velocity 100%
• Scanning Electron Microscopy 25%
• Surface Roughness 25%
• Field Emission 25%
• Atomic Force Microscopy 25%
• Plasma Density 25%
• Flux Density 25%