TY - GEN
T1 - Application of fin structure factor to reduce the body effect in 20 nm DRAM cells
AU - Jung, Ilwoo
AU - Kim, Hyungsub
AU - Choi, Byoungdeog
PY - 2017
Y1 - 2017
N2 - Body effect-a key characteristic of dynamic random access memory (DRAM) cell transistors-is affected by the length and width of conventional planar transistors. However, in buried channel structures developed recently, the fin structure is also known to affect the properties of a transistor. In this paper, the effect of the fin structure on the body effect of a DRAM cell is investigated. In addition, a scheme for reducing this effect is suggested. In order to measure the body effect in a DRAM cell, a nondestructive measurement method was used. This method uses a memory test system for fast, massive, nondestructive measurement. Using the measured data, we compared the body effect and the fin dimension. The results show that there is a strong correlation between the fin height and the body effect.
AB - Body effect-a key characteristic of dynamic random access memory (DRAM) cell transistors-is affected by the length and width of conventional planar transistors. However, in buried channel structures developed recently, the fin structure is also known to affect the properties of a transistor. In this paper, the effect of the fin structure on the body effect of a DRAM cell is investigated. In addition, a scheme for reducing this effect is suggested. In order to measure the body effect in a DRAM cell, a nondestructive measurement method was used. This method uses a memory test system for fast, massive, nondestructive measurement. Using the measured data, we compared the body effect and the fin dimension. The results show that there is a strong correlation between the fin height and the body effect.
UR - https://www.scopus.com/pages/publications/85030536922
U2 - 10.1149/07711.1893ecst
DO - 10.1149/07711.1893ecst
M3 - Conference contribution
AN - SCOPUS:85030536922
SN - 9781623324605
T3 - ECS Transactions
SP - 1893
EP - 1896
BT - Selected Proceedings from the 231st ECS Meeting New Orleans, LA - Spring 2017
PB - Electrochemical Society Inc.
T2 - 231st ECS Meeting
Y2 - 28 May 2017 through 1 June 2017
ER -