Application of fin structure factor to reduce the body effect in 20 nm DRAM cells

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Abstract

Body effect-a key characteristic of dynamic random access memory (DRAM) cell transistors-is affected by the length and width of conventional planar transistors. However, in buried channel structures developed recently, the fin structure is also known to affect the properties of a transistor. In this paper, the effect of the fin structure on the body effect of a DRAM cell is investigated. In addition, a scheme for reducing this effect is suggested. In order to measure the body effect in a DRAM cell, a nondestructive measurement method was used. This method uses a memory test system for fast, massive, nondestructive measurement. Using the measured data, we compared the body effect and the fin dimension. The results show that there is a strong correlation between the fin height and the body effect.

Original languageEnglish
Title of host publicationSelected Proceedings from the 231st ECS Meeting New Orleans, LA - Spring 2017
PublisherElectrochemical Society Inc.
Pages1893-1896
Number of pages4
Edition11
ISBN (Electronic)9781607688174
ISBN (Print)9781623324605
DOIs
StatePublished - 2017
Event231st ECS Meeting - New Orleans, United States
Duration: 28 May 20171 Jun 2017

Publication series

NameECS Transactions
Number11
Volume77
ISSN (Print)1938-6737
ISSN (Electronic)1938-5862

Conference

Conference231st ECS Meeting
Country/TerritoryUnited States
CityNew Orleans
Period28/05/171/06/17

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