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Anisotropic/isotropic atomic layer etching of metals

  • Doo San Kim
  • , Ju Eun Kim
  • , You Jung Gill
  • , Yun Jong Jang
  • , Ye Eun Kim
  • , Kyong Nam Kim
  • , Geun Young Yeom
  • , Dong Woo Kim
  • Sungkyunkwan University
  • Daejeon University

Research output: Contribution to journal › Article › peer-review

Abstract

To determine a suitable etching method for the fabrication of semiconductors with a few nm or less thickness, many atomic layer etching (ALE) techniques have been studied. Previously, ALE studies on silicon-based materials have been reported; however, recently, the number of ALE studies on metals have also been increasing. Metals are applied to semiconductor devices as electrodes and hard mask materials, thus, there is an increasing need for precise etching using ALE techniques. Therefore, in this brief review, recently reported ALE studies on metals will be summarized, and the ALE process results for various metals will be described for two ALE methods, namely, anisotropic ALE and isotropic ALE.

Original languageEnglish
Pages (from-to)41-49
Number of pages9
JournalApplied Science and Convergence Technology
Volume29
Issue number3
DOIs
StatePublished - May 2020

Keywords

  • Anisotropic
  • Atomic layer etching
  • Isotropic
  • Low damage
  • Metal
  • Precise etch

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