TY - GEN
T1 - Analysis of radio frequency interference due to high speed digital signals
AU - Kim, Jihoon
AU - Hwang, Jisoo
AU - Song, Eunseok
AU - Kim, So Young
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2017/7/2
Y1 - 2017/7/2
N2 - As the package or PCB size for integrated systems becomes smaller for IoT or wearable devices, the radio frequency interference (RFI) between high speed data transmission lines and antenna on the same board increases. This paper provides high speed signal design guidelines to reduce the RFI to neighboring antenna based on transient analysis of voltage and E-field. The transient RFI coupling analysis is done based on the models from 3D full-wave simulation. Using the proposed simulation flow, the actual induced coupled noise voltage level and E-field from high-speed I/O to antenna can be estimated. The amount of coupled noise increases when the frequency of noise source is large and when transition time of noise source is fast. Since the antenna sensitivity is less than-100dB, the transient noise can affect the sensitivity of receiver antenna.
AB - As the package or PCB size for integrated systems becomes smaller for IoT or wearable devices, the radio frequency interference (RFI) between high speed data transmission lines and antenna on the same board increases. This paper provides high speed signal design guidelines to reduce the RFI to neighboring antenna based on transient analysis of voltage and E-field. The transient RFI coupling analysis is done based on the models from 3D full-wave simulation. Using the proposed simulation flow, the actual induced coupled noise voltage level and E-field from high-speed I/O to antenna can be estimated. The amount of coupled noise increases when the frequency of noise source is large and when transition time of noise source is fast. Since the antenna sensitivity is less than-100dB, the transient noise can affect the sensitivity of receiver antenna.
KW - digital switching signal
KW - Radio Frequency Interference (RFI)
KW - transmission line
UR - https://www.scopus.com/pages/publications/85050475020
U2 - 10.1109/EDAPS.2017.8277042
DO - 10.1109/EDAPS.2017.8277042
M3 - Conference contribution
AN - SCOPUS:85050475020
T3 - 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017
SP - 1
EP - 3
BT - 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017
Y2 - 14 December 2017 through 16 December 2017
ER -