An ultraviolet-curable mold for Sub-100-nm lithography

Se Jin Choi; Pil J. Yoo; Seung J. Baek; Tae W. Kim; Hong H. Lee

doi:10.1021/ja048972k

An ultraviolet-curable mold for Sub-100-nm lithography

Se Jin Choi
, Pil J. Yoo
, Seung J. Baek
, Tae W. Kim
, Hong H. Lee

Research output: Contribution to journal › Article › peer-review

295 Scopus citations

Abstract

We describe a novel UV-curable mold that is stiff enough for replicating dense sub-100-nm features even with a high aspect ratio. It also allows for flexibility when the mold is prepared on a flexible support such that large area replication can be accomplished. The composite material of the mold is inert to chemicals and solvents. The surface energy is made low with a small amount of releasing agent such that the mold can be removed easily and cleanly after patterning. In addition, the material allows self-replication of the mold. These unique features of the mold material should make the mold quite useful for various patterning purposes.

Original language	English
Pages (from-to)	7744-7745
Number of pages	2
Journal	Journal of the American Chemical Society
Volume	126
Issue number	25
DOIs	https://doi.org/10.1021/ja048972k
State	Published - 30 Jun 2004
Externally published	Yes

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10.1021/ja048972k

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title = "An ultraviolet-curable mold for Sub-100-nm lithography",

abstract = "We describe a novel UV-curable mold that is stiff enough for replicating dense sub-100-nm features even with a high aspect ratio. It also allows for flexibility when the mold is prepared on a flexible support such that large area replication can be accomplished. The composite material of the mold is inert to chemicals and solvents. The surface energy is made low with a small amount of releasing agent such that the mold can be removed easily and cleanly after patterning. In addition, the material allows self-replication of the mold. These unique features of the mold material should make the mold quite useful for various patterning purposes.",

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year = "2004",

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doi = "10.1021/ja048972k",

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T1 - An ultraviolet-curable mold for Sub-100-nm lithography

AU - Choi, Se Jin

AU - Yoo, Pil J.

AU - Baek, Seung J.

AU - Kim, Tae W.

AU - Lee, Hong H.

PY - 2004/6/30

Y1 - 2004/6/30

N2 - We describe a novel UV-curable mold that is stiff enough for replicating dense sub-100-nm features even with a high aspect ratio. It also allows for flexibility when the mold is prepared on a flexible support such that large area replication can be accomplished. The composite material of the mold is inert to chemicals and solvents. The surface energy is made low with a small amount of releasing agent such that the mold can be removed easily and cleanly after patterning. In addition, the material allows self-replication of the mold. These unique features of the mold material should make the mold quite useful for various patterning purposes.

AB - We describe a novel UV-curable mold that is stiff enough for replicating dense sub-100-nm features even with a high aspect ratio. It also allows for flexibility when the mold is prepared on a flexible support such that large area replication can be accomplished. The composite material of the mold is inert to chemicals and solvents. The surface energy is made low with a small amount of releasing agent such that the mold can be removed easily and cleanly after patterning. In addition, the material allows self-replication of the mold. These unique features of the mold material should make the mold quite useful for various patterning purposes.

UR - https://www.scopus.com/pages/publications/3042694518

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DO - 10.1021/ja048972k

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JO - Journal of the American Chemical Society

JF - Journal of the American Chemical Society

IS - 25

ER -

An ultraviolet-curable mold for Sub-100-nm lithography

Abstract

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