An in-situ FTIR study on palladium displacement reaction for autocatalytic electroless copper deposition

Youn Jin Oh, Chan Hwa Chung

Research output: Contribution to conferencePaperpeer-review

Abstract

We have investigated on the mechanism of palladium autocatalytic displacement reaction on the Si substrate in PdCl2-HCl-HF-NH 4OH bath, which occurs to the Pd activation step in electroless Cu deposition process. It has been monitored that Pd(NH3) 4Cl2 in the electrolyte is reduced to Pd particles by displacement reaction with substrate silicon and NH4+ complex are generated during the Pd activatioa In the in-situ FTIR analysis, N-H vibration peaks in Pd(NH3)4Cl2 of electrolyte are shifted to N-H peaks in NH4+ complex. The IR peaks of SiF62-and N-H bonds of NH4 + are also evident during the Pd activation on the Si surface. It reveals that palladium in Pd(NH3)4Cl2 has been reduced to metallic Pd particles on Si substrate and (NH4) 2SiF6 compound has been produced.

Original languageEnglish
Pages79-87
Number of pages9
StatePublished - 2003
EventCopper Interconnects, New Contact Metallurgies/Structures, and Low-k Interlevel Dielectrics II - Proceedings of the International Symposium - Orlando, FL, United States
Duration: 12 Oct 200317 Oct 2003

Conference

ConferenceCopper Interconnects, New Contact Metallurgies/Structures, and Low-k Interlevel Dielectrics II - Proceedings of the International Symposium
Country/TerritoryUnited States
CityOrlando, FL
Period12/10/0317/10/03

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