Abstract
We have investigated on the mechanism of palladium autocatalytic displacement reaction on the Si substrate in PdCl2-HCl-HF-NH 4OH bath, which occurs to the Pd activation step in electroless Cu deposition process. It has been monitored that Pd(NH3) 4Cl2 in the electrolyte is reduced to Pd particles by displacement reaction with substrate silicon and NH4+ complex are generated during the Pd activatioa In the in-situ FTIR analysis, N-H vibration peaks in Pd(NH3)4Cl2 of electrolyte are shifted to N-H peaks in NH4+ complex. The IR peaks of SiF62-and N-H bonds of NH4 + are also evident during the Pd activation on the Si surface. It reveals that palladium in Pd(NH3)4Cl2 has been reduced to metallic Pd particles on Si substrate and (NH4) 2SiF6 compound has been produced.
| Original language | English |
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| Pages | 79-87 |
| Number of pages | 9 |
| State | Published - 2003 |
| Event | Copper Interconnects, New Contact Metallurgies/Structures, and Low-k Interlevel Dielectrics II - Proceedings of the International Symposium - Orlando, FL, United States Duration: 12 Oct 2003 → 17 Oct 2003 |
Conference
| Conference | Copper Interconnects, New Contact Metallurgies/Structures, and Low-k Interlevel Dielectrics II - Proceedings of the International Symposium |
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| Country/Territory | United States |
| City | Orlando, FL |
| Period | 12/10/03 → 17/10/03 |