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An Effective 3D Thermal Network Integrated with Deep Learning for Improved Prediction of the 3D Thermal Properties of Complex Packaging Patterns

  • Jeong Hyeon Park
  • , Jaechoon Kim
  • , Sukwon Jang
  • , Sungho Mun
  • , Eun Ho Lee

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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