TY - JOUR
T1 - Achieving low dielectric, surface free energy and UV shielding green nanocomposites
T2 - Via reinforcing bio-silica aerogel with polybenzoxazine
AU - Prabunathan, P.
AU - Thennarasu, P.
AU - Song, J. K.
AU - Alagar, M.
N1 - Publisher Copyright:
© 2017 The Royal Society of Chemistry and the Centre National de la Recherche Scientifique.
PY - 2017
Y1 - 2017
N2 - In the present study, silica aerogel (SA) derived from rice husk ash was functionalized using benzoxazine terminated silane (FSA) and was used as a nanoreinforcement for industrial valuable resin polybenzoxazine (PBZ) in order to improve the dielectric, surface and UV shielding behavior of the resulting nanocomposites. From the data of different studies, it was observed that the porous morphology, lower polarity due to the presence of a siloxane network and hydrophobic nature of FSA contribute to both the low dielectric constant (2.16) and low surface free energy (mJ m-2) with a high shielding behavior of 94.4%. Thus, the green nanocomposites obtained from ecofriendly biomass silica with a low dielectric constant, low surface free energy and high UV shielding behavior can be used as adhesives, sealants and encapsulants for high performance microelectronics insulation applications, where structural integrity is warranted.
AB - In the present study, silica aerogel (SA) derived from rice husk ash was functionalized using benzoxazine terminated silane (FSA) and was used as a nanoreinforcement for industrial valuable resin polybenzoxazine (PBZ) in order to improve the dielectric, surface and UV shielding behavior of the resulting nanocomposites. From the data of different studies, it was observed that the porous morphology, lower polarity due to the presence of a siloxane network and hydrophobic nature of FSA contribute to both the low dielectric constant (2.16) and low surface free energy (mJ m-2) with a high shielding behavior of 94.4%. Thus, the green nanocomposites obtained from ecofriendly biomass silica with a low dielectric constant, low surface free energy and high UV shielding behavior can be used as adhesives, sealants and encapsulants for high performance microelectronics insulation applications, where structural integrity is warranted.
UR - https://www.scopus.com/pages/publications/85021752227
U2 - 10.1039/c7nj00138j
DO - 10.1039/c7nj00138j
M3 - Article
AN - SCOPUS:85021752227
SN - 1144-0546
VL - 41
SP - 5313
EP - 5321
JO - New Journal of Chemistry
JF - New Journal of Chemistry
IS - 13
ER -