A review of the thermo-mechanical analysis framework for microelectronics packaging: Mechanics, material property determination, and structural considerations

Recent advances in microelectronics packaging, including chiplet architectures and heterogeneous integration, have introduced complex interconnections and the integration of dissimilar materials. These developments complicate the thermal and mechanical behavior of packaging, impacting semiconductor performance and reliability. To address these challenges, a systematic approach to analyzing the thermal-mechanical behavior of microelectronics packages is required. This paper reviews frameworks and methodologies for analyzing such behavior, focusing on the integration of three key tools: mechanics theory, material property determination, and structural pattern consideration. This paper specifically goes beyond individual reviews of the three tools—mechanics theory, material property determination, and structural patterns. Instead, it focuses on systematically analyzing the interconnections among these three tools. To clearly define localized mechanics theory, appropriate material property determination is essential. Furthermore, integrating the constitutive equations for structural analysis becomes increasingly challenging as structural patterns grow more complex. Therefore, a thorough understanding and analysis of the relationships and complementarities among these three tools is crucial. The paper begins by discussing the thermal-mechanical balance laws and dissipation applied within mechanics theory. It examines the coupling between mechanical and thermal aspects in thermodynamic laws and the challenges in determining properties for constitutive equations. The paper then reviews measurement methods for determining mechanical and thermal properties, such as thermal expansion coefficients, highlighting the pros and cons of each technique. Given that mechanics and material properties are applied at local points, the paper also addresses the importance of considering the structure in analysis. Lastly, it discusses the advantages and disadvantages of traditional analytical methods, simulations, and artificial intelligence in evaluating structural characteristics. As the thermo-mechanical behavior of packages becomes more complex, the integration of mechanics, material property determination, and structural considerations will be crucial in understanding and optimizing microelectronics packaging.